Light emitting device, package, and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016118558-A1
Application number	US-201514921706-A
Country	US
Kind code	A1
Filing date	Oct 23, 2015
Priority date	Oct 24, 2014
Publication date	Apr 28, 2016
Grant date	—

Abstract

A light emitting device includes a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and a light emitting element electrically connected to the lead frame. An outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film.

First claim

What is claimed is:

1 . A light emitting device comprising:
a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and a light emitting element electrically connected to the lead frame, wherein an outer side surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film.

2 . The light emitting device according to claim 1 , wherein the reflective film contains particles of a first light reflective substance.

3 . The light emitting device according to claim 1 , wherein the resin member comprises a second light reflective substance in a light transmissive resin.

4 . The light emitting device according to claim 1 , further comprising a light-transmissive member provided in the recess and covering the light emitting element.

5 . The light emitting device according to claim 1 , wherein:
the first light reflective substance comprises particles of a white pigment, and the reflective film has higher reflectance than the resin member.

6 . The light emitting device according to claim 1 , wherein:
the first light reflective substance comprises nanoparticles having an average particle size in a range of 10 nm to 300 nm, and the reflective film is a coagulation film of the nanoparticles.

7 . The light emitting device according to claim 1 , wherein the second light reflective substance comprises particles having an average particle size in a range of 0.08 μm to 10 μm.

8 . The light emitting device according to claim 2 , wherein the first light reflective substance is TiO 2 .

9 . The light emitting device according to claim 1 , wherein:
the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and the reflective film covers at least a portion of an outer surface of the thin wall portions.

10 . The light emitting device according to claim 9 , wherein the lead frame extends from the bottom surface of the recess to a side of the outer surface of one of the thin wall portions.

11 . The light emitting device according to claim 4 , wherein the light-transmissive member contains a wavelength conversion substance that converts light emitted from the light emitting element into light of different wavelength.

12 . A package comprising:
a resin member having an inner side surface defining a recess; and a lead frame supported by the resin member and arranged at a bottom surface of the recess, wherein an outer surface of the resin member at a portion corresponding to the recess is at least partially covered with a reflective film.

13 . The package according to claim 12 , wherein:
the recess is defined by two opposing thin wall portions, and two opposing thick wall portions that are thicker than the thin wall portions, and the reflective film is provided to at least partially cover an outer surface of the thin wall portions.

14 . A method of manufacturing a light emitting device comprising:
providing an assembly comprising:
a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess, and
a light emitting element electrically connected to the lead frame; and
forming a reflective film containing particles of a first light reflective substance on at least a portion of an outer surface of the resin member corresponding to the recess.

15 . A method of manufacturing a light emitting device comprising:
providing a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; forming a reflective film containing particles of a first light reflective substance on at least portion of an outer side surface of the resin member corresponding to the recess; electrically connecting a light emitting element to the lead frame; and covering the light emitting element with a light-transmissive member.

16 . A method of manufacturing a package comprising:
providing a package including a resin member having an inner side surface defining a recess, and a lead frame supported by the resin member and arranged at a bottom surface of the recess; and forming a reflective film containing particles of a first light reflective substance on at least portion of an outer side surface of the resin member corresponding to the recess.

Assignees

• Nichia Corp

Inventors

• Abe Koji

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/856 Primary

  Reflecting means · CPC title

• H01L33/60 Primary

  Electricity · mapped topic