Semiconductor Manufacturing Device to Securely Hold Reconstituted Panels for Transport and Manufacturing Processes
US-2022392795-A1 · Dec 8, 2022 · US
specially adapted for containing substrates other than wafers
specially adapted for containing substrates other than wafers · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/1908 |
| Official title | {specially adapted for containing substrates other than wafers} |
| Display label | specially adapted for containing substrates other than wafers |
| Total patents | 113 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 8 |
| 2017 | 4 |
| 2018 | 6 |
| 2019 | 10 |
| 2020 | 15 |
| 2021 | 6 |
| 2022 | 19 |
| 2023 | 14 |
| 2024 | 15 |
| 2025 | 11 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate treating apparatus and substrate treating system
US-2022384147-A1 · Dec 1, 2022 · US
Semiconductor substrate carrying container with increased diameter purge ports
US-2022384227-A1 · Dec 1, 2022 · US
Container and substrate treating system
US-2022384160-A1 · Dec 1, 2022 · US
Packaging container for transporting ceramic substrates
US-2022355978-A1 · Nov 10, 2022 · US
Apparatus for affixing sheet
US-11488853-B2 · Nov 1, 2022 · US
Apparatus for affixing sheet
US-2022254674-A1 · Aug 11, 2022 · US
Packaging unit for substrates
US-2022037179-A1 · Feb 3, 2022 · US
Storage container for electronic devices
US-11148864-B1 · Oct 19, 2021 · US
Housing Case for Crystal Oscillator
US-2021257238-A1 · Aug 19, 2021 · US
Process kit ring adaptor
US-2021217650-A1 · Jul 15, 2021 · US
Substrate carrier having hard mask
US-11047039-B2 · Jun 29, 2021 · US
Process kit ring adaptor
US-10964584-B2 · Mar 30, 2021 · US
Carrier foup and a method of placing a carrier
US-2021028039-A1 · Jan 28, 2021 · US
Process kit enclosure system
US-2020373190-A1 · Nov 26, 2020 · US
Process kit ring adaptor
US-2020373194-A1 · Nov 26, 2020 · US
Tray module, tray assembly having the tray module, and method of fabricating display device using the tray assembly
US-2020301063-A1 · Sep 24, 2020 · US
FOUP purge shield
US-10784136-B2 · Sep 22, 2020 · US
Container, container partition plate, substrate processing system, and substrate tranfer method
US-2020286752-A1 · Sep 10, 2020 · US
Automated replacement of consumable parts using interfacing chambers
US-10770339-B2 · Sep 8, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/1908?
- CPC H10P72/1908 is the Cooperative Patent Classification code for “specially adapted for containing substrates other than wafers.”
- How many patents are filed under CPC H10P72/1908 (specially adapted for containing substrates other than wafers)?
- Our database includes 113 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/1908 growing?
- Publication counts under this code: 15 in 2024 vs 11 in 2025 (latest complete years).