Photoresist composition and method of fabricating display substrate using the same
US-2015301452-A1 · Oct 22, 2015 · US
US10260152B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10260152-B2 |
| Application number | US-201415029328-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2014 |
| Priority date | Oct 15, 2013 |
| Publication date | Apr 16, 2019 |
| Grant date | Apr 16, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A method, and corresponding apparatus, of fabricating a structure by chemical wet etching starting from a material rod of millimetric or sub-millemetric size, the method comprising: dipping an end portion (170) of the material rod (128,129) into a vessel (105) containing an etchant liquid (110) and a protective overlayer (175) floating on top of the etchant liquid, imparting a relative rotational movement of the etchant liquid with respect to the end portion (170) of the material rod immersed therein, wherein said imparting a relative rotational movement comprises imparting to the etchant liquid a rotational movement component with respect to a static reference system.
Opening claim text (preview).
The invention claimed is: 1. A method of fabricating a nanostructure by chemical wet etching starting from a material rod of millimetric or sub-millimetric size, the method comprising: dipping an end portion ( 170 ) of the material rod ( 128 , 129 ) into a vessel ( 105 ) containing an etchant liquid ( 110 ) and a protective overlayer ( 175 ) floating on top of the etchant liquid, imparting a relative rotational movement of the etchant liquid with respect to the end portion ( 170 ) of the material rod immersed therein, characterized in that said imparting a relative rotational movement comprises imparting to the etchant liquid a rotational movement component with respect to a static reference system such that the etchant liquid flows in a direction opposite that of the rod. 2. The method of claim 1 , further comprising: while imparting to the etchant liquid said rotational movement component with respect to the static reference system, gradually extracting the end portion ( 170 ) of the material rod from the etchant liquid. 3. The method of claim 1 , wherein said imparting a relative rotational movement of the etchant liquid ( 110 ) with respect to the end portion ( 170 ) of the material rod comprises imparting to the vessel ( 105 ) a rotational movement with respect to said static reference system. 4. The method of claim 3 , wherein said imparting a relative rotational movement of the etchant liquid ( 110 ) with respect to the end portion ( 170 ) of the material rod comprises imparting to the material rod a rotational movement with respect to said static reference system. 5. The method of claim 1 , wherein said material rod is immersed into the etchant liquid with a longitudinal axis of the material rod essentially coaxial with a rotation axis of the etchant liquid with respect to said static reference system. 6. The method of claim 1 , wherein said material rod is immersed into the etchant liquid with a longitudinal axis of the material rod essentially parallel but not coaxial with a rotation axis of the etchant liquid with respect to said static reference system. 7. The method of claim 1 , wherein said material rod is immersed into the etchant liquid with a longitudinal axis of the material rod slanted with respect to a rotation axis of the etchant liquid with respect to said static reference system. 8. The method of claim 1 , wherein the material rod is an optical fiber ( 128 , 129 ), and further comprising: propagating an optical radiation through the optical fiber; detecting a transmitted and/or scattered and/or back-reflected optical radiation, respectively transmitted and/or scattered and/or back-reflected at an optical fiber tip ( 170 ) of the optical fiber immersed in the etchant liquid to monitor a process of formation of said tip. 9. The method of claim 8 , wherein said detecting the transmitted and/or scattered and/or back-reflected optical radiation comprises comparing an intensity of the transmitted and/or scattered and/or back-reflected optical radiation to predetermined patterns. 10. A method of fabricating a nanostructure by chemical wet etching starting from a material rod of millimetric or sub-millimetric size, the method comprising: dipping an end portion ( 170 ) of the material rod ( 128 , 129 ) into a vessel ( 105 ) containing an etchant liquid ( 110 ) and a protective overlayer ( 175 ) floating on top of the etchant liquid, imparting a relative rotational movement of the etchant liquid with respect to the end portion ( 170 ) of the material rod immersed therein, characterized in that: said imparting a relative rotational movement comprises imparting to the etchant liquid a rotational movement component with respect to a static reference system; and dipping the end portion of the material rod includes immersing the material rod into the etchant liquid with a longitudinal axis of the material rod slanted with respect to a rotation axis of the etchant liquid with respect to said static reference system. 11. A method of fabricating a nanostructure by chemical wet etching starting from a material rod of millimetric or sub-millimetric size, the method comprising: dipping an end portion ( 170 ) of the material rod ( 128 , 129 ) into a vessel ( 105 ) containing an etchant liquid ( 110 ) and a protective overlayer ( 175 ) floating on top of the etchant liquid, wherein the material rod is an optical fiber, imparting a relative rotational movement of the etchant liquid with respect to the end portion ( 170 ) of the material rod immersed therein, propagating an optical radiation through the optical fiber, detecting a transmitted and/or scattered and/or back-reflected optical radiation, respectively transmitted and/or scattered and/or back-reflected at an optical fiber tip ( 170 ) of the optical fiber immersed in the etchant liquid to monitor a process of formation of said tip, characterized in that: said imparting a relative rotational movement comprises imparting to the etchant liquid a rotational movement component with respect to a static reference system, and detecting the transmitted and/or scattered and/or back-reflected optical radiation comprises comparing an intensity of the transmitted and/or scattered and/or back-reflected optical radiation to predetermined patterns.
with the semiconductor substrates being dipped in baths or vessels · CPC title
for wet etching · CPC title
Etching of wafers, substrates or parts of devices · CPC title
the work being immersed in the liquid or other fluent material · CPC title
the articles being moved through the liquid or other fluent material (conveying articles through baths B65G, e.g. B65G49/02) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.