Methods for forming recesses in source/drain regions and devices formed thereof
US-12132089-B2 · Oct 29, 2024 · US
US9136137B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136137-B2 |
| Application number | US-201414263956-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 28, 2014 |
| Priority date | Sep 24, 2013 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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An etchant composition including 0.5 wt % to 20 wt % of a persulfate, 0.01 wt % to 1 wt % of a fluorine compound, 1 wt % to 10 wt % of an inorganic acid, 0.01 wt % to 2 wt % of an azole-based compound, 0.1 wt % to 5 wt % of a chlorine compound, 0.05 wt % to 3 wt % of a copper salt, 0.01 wt % to 5 wt % of an antioxidant or a salt thereof, based on a total weight of the etchant composition, and water in an amount sufficient for the total weight of the etchant composition to be equal to 100 wt % is disclosed. The etchant composition is suitable for use in forming a metal wiring by etching a metal layer including copper or in fabricating a thin film transistor substrate for a display apparatus.
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What is claimed is: 1. An etchant composition comprising: 0.5 wt % to 20 wt % of a persulfate; 0.01 wt % to 1 wt % of a fluorine compound; 1 wt % to 10 wt % of an inorganic acid; 0.01 wt % to 2 wt % of an azole-based compound; 0.1 wt % to 5 wt % of a chlorine compound; 0.05 wt % to 3 wt % of a copper salt; 0.01 wt % to 5 wt % of an antioxidant or a salt thereof comprising ascorbic acid, glutathione, lipoic acid, uric acid, or a salt thereof, based on a total weight of…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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