Membrane bonding with photoresist

Patent metadata

Field	Value
Publication number	US-10252908-B2
Application number	US-201815902570-A
Country	US
Kind code	B2
Filing date	Feb 22, 2018
Priority date	May 20, 2015
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

First claim

The invention claimed is:

1. A method comprising:
applying a photoresist to a surface;
covering a first portion of the photoresist on the surface;
exposing a second portion of the photoresist that was not covered to a light source;
removing either the first portion of the photoresist or the second portion of the photoresist to create a remaining portion of the photoresist on the surface; and
applying a bonding agent to the remaining portion of the photoresist on the surface.

2. The method of claim 1 , further comprising:
placing a membrane on the surface such that the membrane is in contact with the bonding agent.

3. The method of claim 2 , further comprising:
applying pressure to the membrane.

4. The method of claim 2 , wherein the surface is a surface of either an ultrasonic device or a laminate material.

5. The method of claim 1 , wherein applying the bonding agent to the surface comprises:
applying the bonding agent to a roller; and
rolling the roller across a top of the remaining portion of the photoresist on the surface.

6. The method of claim 1 , wherein the second portion of the photoresist is removed when the photoresist is a positive photoresist and wherein the first portion of the photoresist is removed when the photoresist is a negative photoresist.

7. The method of claim 1 , wherein the bonding agent is an epoxy.

8. A method comprising:
applying a photoresist to a surface;
covering a first portion of the photoresist on the surface;
exposing a second portion of the photoresist that was not covered to a light source;
removing the first portion of the photoresist to create a remaining portion of the photoresist on the surface, the remaining portion of the photoresist comprising the second portion of the photoresist; and
applying an epoxy to the remaining portion of the photoresist on the surface, wherein the epoxy forms epoxy lines on the surface.

9. The method of claim 8 , further comprising:
placing a membrane on the ultrasonic device such that the membrane is in contact with the epoxy.

10. The method of claim 9 , further comprising:
applying pressure to the membrane.

11. The method of claim 9 , further comprising before placing the membrane on the surface, preparing or texturing at least one surface of the membrane, and wherein the at least one prepared or textured surface is placed in contact with the epoxy of the surface when the membrane is placed on the surface.

12. The method of claim 8 , wherein the epoxy lines form bond lines after the epoxy has cured.

13. The method of claim 8 , where the first portion of the photoresist is removed using a developer liquid for the photoresist.

14. A method comprising:
applying a photoresist to a surface;
covering a first portion of the photoresist on the surface;
exposing a second portion of the photoresist that was not covered to a light source, wherein the first portion of the photoresist;
removing the second portion of the photoresist to create a remaining portion of the photoresist on the surface, the remaining portion of the photoresist comprising the first portion of the photoresist; and
applying an epoxy to the remaining portion of the photoresist on the surface, wherein the epoxy forms epoxy lines on the surface.

15. The method of claim 14 , further comprising:
placing a membrane on the surface such that the membrane is in contact with the epoxy.

16. The method of claim 15 , further comprising:
applying pressure to the membrane.

17. The method of claim 14 , wherein the epoxy lines form bond lines after the epoxy has cured.

18. The method of claim 14 , further comprising before placing the membrane on the surface, preparing or texturing at least one surface of the membrane, and wherein the at least one prepared or textured surface is placed in contact with the epoxy of the surface when the membrane is placed on the surface.

19. The method of claim 14 , where the first portion of the photoresist is removed using a developer liquid for the photoresist.

20. The method of claim 14 , wherein the surface is a surface of either an ultrasonic device or laminate material.

Assignees

• Ubeam Inc

Inventors

• Joyce Andrew
• Taffler Sean
• Reynolds Paul
• Nemeth Nicholas Lavada
• Elhadad Adam Stephen
• Faraji Boozarjomehr

Classifications

• G03F7/00

  Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• B81C2203/032

  Gluing · CPC title

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title

• F16B11/006

  by gluing (gluing of plastics material B29C65/48) · CPC title