Image sensor package and an image sensor module having the same

Patent metadata

Field	Value
Publication number	US-2016204155-A1
Application number	US-201514593500-A
Country	US
Kind code	A1
Filing date	Jan 9, 2015
Priority date	Jan 9, 2015
Publication date	Jul 14, 2016
Grant date	—

Abstract

Disclosed are an image sensor package and an image sensor module having the same. A diffusion resistor is provided on a circuit board for preventing liquid drop diffusion when the liquid drop is compressed. An image sensor chip is mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board. A bonding member is interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip. Warpage characteristics of the image sensor package are improved by the diffusion resistor.

First claim

1 . An image sensor package comprising:
a circuit board having a diffusion resistor for preventing liquid drop diffusion due to a compression to a liquid drop; an image sensor chip mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board; and a bonding member interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip, wherein the image sensor chip includes an active pixel sensor (APS) for generating signal electrons in response to external optical signals, a logic unit connected to the APS and processing of the APS corresponding to the signal electrons and a shield layer covering the logic unit and shielding electromagnetic waves.

2 . The image sensor package of claim 1 , wherein the diffusion resistor includes a protrusion portion protruding from a front surface of the circuit board to a protrusion height in such a configuration that the bonding member covers top and side portions of the protrusion portion.

3 . The image sensor package of claim 2 , further comprising an anti-deflection member filling a gap space between the circuit board and a peripheral portion of the image sensor chip, to thereby prevent a deflection of the image sensor chip toward the circuit board.

4 . The image sensor package of claim 1 , wherein the diffusion resistor includes a recess recessed from a front surface of the circuit board to a recess depth in such a configuration that the bonding member is positioned in the recess and on the front surface around the recess.

5 . The image sensor package of claim 1 , wherein the diffusion resistor includes an isolated portion defined by a trench on the front surface of the circuit board in such a configuration that the bonding member is positioned on the isolated portion and in the trench of the circuit board.

6 . The image sensor package of claim 1 , wherein the bonding member includes one of epoxy resin, acryl resin, polyimide resin and silicone resin.

7 . The image sensor package of claim 6 , further comprising at least one bonding wire connecting the image sensor chip and the circuit board.

8 . (canceled)

9 . The image sensor package of claim 1 , wherein the APS and the logic unit include a plurality of complementary metal-oxide semiconductor (CMOS) devices.

10 . The image sensor package of claim 1 , wherein the circuit board include one of an organic substrate, a silicon substrate, a ceramic substrate and a glass-reinforced epoxy substrate.

11 . The image sensor package of claim 1 , wherein the bonding area is 50% to 70% of the surface area of the bonding face of the image sensor chip.

12 . An image sensor module comprising:
an image sensor package including a circuit board having a diffusion resistor for preventing liquid drop diffusion due to a compression to a liquid drop, an image sensor chip mounted on the circuit board in such a configuration that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board and generating image signals from optical signals, and a bonding member interposed between the circuit board and the image sensor chip around the diffusion resistor in such a configuration that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip; a housing installed on the circuit board to cover the image sensor chip and having an opening through the image sensor chip is partially exposed; and a lens unit guiding the optical signals to the image sensor chip through the opening, wherein the image sensor chip includes an active pixel sensor (APS) for generating signal electrons in response to external optical signals, a logic unit connected to the APS and processing of the APS corresponding to the signal electrons and a shield layer covering the logic unit and shielding electromagnetic waves.

13 . The image sensor module of claim 12 , wherein the bonding area is 50% to 70% of the surface area of the bonding face of the image sensor chip.

14 . The image sensor module of claim 12 , wherein the diffusion resistor includes one of a protrusion portion protruding from a front surface of the circuit board to a protrusion height, a recess recessed from a front surface of the circuit board to a recess depth and an isolated portion defined by a trench on the front surface of the circuit board.

15 . The image sensor module of claim 12 , wherein the image sensor chip includes a CMOS image sensor chip having at least one complementary metal-oxide semiconductor (CMOS) device.

16 . An image sensor package comprising:
a circuit board having a diffusion resistor for preventing liquid drop diffusion due to a compression to a liquid drop; an image sensor chip mounted on the circuit board such that a central portion of the image sensor chip is positioned on the diffusion resistor of the circuit board; and a bonding member interposed between the circuit board and the image sensor chip around the diffusion resistor such that a bonding area of the image sensor chip is smaller than a surface area of a bonding face of the image sensor chip, wherein the diffusion resistor includes a protrusion portion protruding from a front surface of the circuit board to a protrusion height in such a configuration that the bonding member covers top and side portions of the protrusion portion.

17 . The image sensor package of claim 16 , further comprising an anti-deflection member filling a gap space between the circuit board and a peripheral portion of the image sensor chip, to thereby prevent a deflection of the image sensor chip toward the circuit board.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Ok-Gyeong

Classifications

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/07302

  using an auxiliary member · CPC title

• H10W72/321

  Structures or relative sizes of die-attach connectors · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title