Photosensitive resin composition, resist laminate, and cured product thereof (1)

Patent metadata

Field	Value
Publication number	US-10241408-B2
Application number	US-201314437933-A
Country	US
Kind code	B2
Filing date	Oct 25, 2013
Priority date	Oct 26, 2012
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

First claim

The invention claimed is:

1. A photosensitive resin composition comprising: an epoxy resin (A), a polyol compound (B), a cationic photopolymerization initiator (C), and an epoxy group-containing silane compound (D);
wherein the epoxy resin (A) comprises an epoxy resin (a) obtained from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin:

and an epoxy resin (b) represented by the following Formula (2):

wherein m is an average value, representing a real number in the range from 4 to 6, R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, each X independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group; and
the polyol compound (B) comprises a polyester polyol represented by the following Formula (3):

wherein x is an average value, representing a real number in the range from 1 to 9, and R 3 represents a divalent aliphatic hydrocarbon group which may comprise at least one ether bond within carbon chain of the hydrocarbon group;
and/or a polyester polyol represented by the following Formula (4):

wherein y is an average value, representing a real number in the range from 1 to 4, and R 4 represents a trivalent aliphatic hydrocarbon group which may comprise at least one ether bond within carbon chain of the hydrocarbon group;
wherein a blending ratio of the polyol compound (B) is 1 to 30 mass % relative to a mass of the epoxy resin (A);
wherein a blending ratio of the cationic photopolymerization initiator (C) is 0.1 to 15 mass % to a total mass of the epoxy resin (A) and the polyol compound (B);
wherein a blending ratio of the epoxy group-containing silane compound (D) is 1 to 15 mass % relative to a total mass of the epoxy resin (A), the polyol compound (B), and the cationic photopolymerization initiator (C); and
wherein the ratio of the amount of the epoxy resin (b) to the amount of the epoxy resin (a) ranges from 10 to 70 mass %.

2. The photosensitive resin composition according to claim 1 , wherein the epoxy group-containing silane compound (D) is an epoxy group-containing alkoxysilane compound.

3. The photosensitive resin composition according to claim 1 , further comprising a solvent (E).

4. The photosensitive resin composition according to claim 3 , wherein a blending ratio of the solvent (E) is 5 to 95 mass % relative to a total mass of the photosensitive resin composition including the solvent (E).

5. A cured product of the photosensitive resin composition according to any one of claims 1 , 2 , 3 or 4 .

6. A resist laminate comprising the photosensitive resin composition according to any one of claims 1 , 2 , 3 or 4 sandwiched between two substrates.

7. A cured product of a dry film resist formed from the resist laminate according to claim 6 .

Assignees

• Nippon Kayaku Kk

Inventors

• Imaizumi Naoko
• Inagaki Shinya
• Honda Nao

Classifications

• B32B27/38

  comprising epoxy resins · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

• G03F7/0755 Primary

  Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• B32B27/06

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title

• B32B2559/00

  Photographic equipment or accessories · CPC title