Photosensitive resin composition, resist laminate, and cured product thereof (2)

Patent metadata

Field	Value
Publication number	US-9684239-B2
Application number	US-201314437940-A
Country	US
Kind code	B2
Filing date	Oct 25, 2013
Priority date	Oct 26, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

First claim

The invention claimed is:

1. A photosensitive resin composition comprising: an epoxy resin (A), a polyhydric phenol compound (B), a cationic photopolymerization initiator (C), and an epoxy group-containing silane compound (D);
wherein the epoxy resin (A) comprises an epoxy resin (a) obtained from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin:

and an epoxy resin (b) represented by the following Formula (2):

wherein m is an average value, representing a real number in the range from 2 to 30, R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, each X independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group; and
the polyhydric phenol compound (B) comprises one or more selected from the group consisting of phenol compounds represented by the following Formulas (3) to (6):

wherein p is an average value, representing a real number in the range from 1 to 10, and each R independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;

wherein q is an average value, representing a real number in the range from 1 to 10;

wherein z is an average value, representing a real number in the range from 1 to 10;

wherein y is an average value, representing a real number in the range from 1 to 10, and R 8 and R 9 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and
wherein a blending ratio of the polyhydric phenol compound (B) is 1 to 40 mass % relative to a mass of the epoxy resin (A).

2. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the cationic photopolymerization initiator (C) is 0.1 to 15 mass % relative to a total mass of the epoxy resin (A) and the polyhydric phenol compound (B).

3. The photosensitive resin composition according to claim 1 , wherein the epoxy group-containing silane compound (D) is an epoxy group-containing alkoxysilane compound.

4. The photosensitive resin composition according to claim 1 , wherein a blending ratio of the epoxy group-containing silane compound (D) is 1 to 15 mass % relative to a total mass of the epoxy resin (A), the polyhydric phenol compound (B), and the cationic photopolymerization initiator (C).

5. The photosensitive resin composition according to claim 1 , further comprising a solvent (E).

6. The photosensitive resin composition according to claim 5 , wherein a blending ratio of the solvent (E) is 5 to 95 mass % relative to a total mass of the photosensitive resin composition including the solvent (E).

7. A cured product of the photosensitive resin composition according to claim 1 .

8. A resist laminate comprising the photosensitive resin composition according claim 1 sandwiched between two substrates.

9. A cured product of a dry film resist formed from the resist laminate according to claim 8 .

Assignees

• Nippon Kayaku Kk

Inventors

• Imaizumi Naoko
• Inagaki Shinya
• Honda Nao

Classifications

• G03F7/0755

  Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• G03F7/0751 Primary

  used as adhesion-promoting additives or as means to improve adhesion · CPC title

• G03F7/038 Primary

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title