Liquid processing apparatus, liquid processing method, and storage medium

Patent metadata

Field	Value
Publication number	US-10236192-B2
Application number	US-201414548453-A
Country	US
Kind code	B2
Filing date	Nov 20, 2014
Priority date	Nov 25, 2013
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.

First claim

What is claimed is:

1. A liquid processing apparatus comprising:
a substrate holding table configured to hold a substrate horizontally;
a driving unit connected to the substrate holding table to rotatably support the substrate holding table and configured to rotate the substrate holding table around a vertical axis;
a main nozzle configured to eject a processing liquid onto a surface of the substrate held in the substrate holding table;
a nozzle moving mechanism including a guide rail and a slider, and configured to reciprocate the main nozzle between a first ejection position where the processing liquid ejected from the main nozzle reaches a center of the substrate and a second ejection position closer to a peripheral side of the substrate than the first ejection position, and move the main nozzle among the first ejection position, the second ejection position, and a standby position;
a sub nozzle configured to eject the processing liquid to a third ejection position closer to a peripheral side of the substrate than the first ejection position, the third ejection position being spaced at an angle of 180° to 270° in a rotating direction of the substrate from the second ejection position of the main nozzle above the substrate; and
a control device configured to control a flow rate of the processing liquid ejected from the main nozzle and the sub nozzle such that the flow rate of the processing liquid ejected from the sub nozzle is set to be higher than the flow rate of the processing liquid ejected from the main nozzle,
wherein the control device is configured to control the main nozzle and the sub nozzle such that the main nozzle ejects the processing liquid onto the surface of the substrate while reciprocating between the first ejection position and the second ejection position, and the sub nozzle ejects the processing liquid onto the surface of the substrate while being fixed at the third ejection position, and
wherein the processing liquid ejected by the main nozzle and the processing liquid ejected by the sub nozzle are the same processing liquid supplied from one processing liquid source.

2. The liquid processing apparatus of claim 1 , wherein a distance between the third ejection position and the center of the substrate is the same as a distance between the second ejection position and the center of the substrate.

3. The liquid processing apparatus of claim 1 , wherein a temperature difference between the maximum value and the minimum value within the substrate ranging from the central portion to the peripheral portion is equal to or lower than 1.5° C.

4. The liquid processing apparatus of claim 1 , wherein an equation [(Max−Min)/(Max+Min)/2]×100<5.0% is satisfied, where Max is the maximum temperature of the substrate and Min is the minimum temperature of the substrate within a range from the central portion to the peripheral portion of the substrate.

5. The liquid processing apparatus of claim 1 , wherein the second ejection position is positioned closer to the central side than a position approaching 45 mm from the periphery of the substrate to the central side thereof.

6. The liquid processing apparatus of claim 1 , wherein the first ejection position is spaced away from a central position of the substrate.

7. The liquid processing apparatus of claim 1 , wherein the nozzle moving mechanism includes:
a nozzle arm provided with the main nozzle at one end thereof;
wherein the guide rail is extended in a straight line, and
the slider is configured to support the other end of the nozzle arm and travel on the guide rail to move the main nozzle transversely along a radial direction of the substrate.

8. The liquid processing apparatus of claim 1 , wherein the main nozzle and the sub nozzle are configured to eject the same processing liquid when the substrate is rotated in one rotation direction.

9. The liquid processing apparatus of claim 1 , wherein the main nozzle and the sub nozzle are configured to eject the processing liquid in the same direction.

10. The liquid processing apparatus of claim 1 , wherein the first ejection position is positioned at an outer peripheral side spaced about 30 mm away from the center of the substrate, and the second ejection position is positioned at the outer peripheral side spaced about 105 mm away from the center of the substrate.

11. The liquid processing apparatus of claim 1 , wherein the control device is further configured to control the main nozzle such that the main nozzle ejects the processing liquid onto the surface of the substrate while reciprocating between the first ejection position and the second ejection position at a speed of about 150 mm/sec.

Assignees

• Tokyo Electron Ltd

Inventors

• Nonaka Jun
• Mizota Shogo
• Nagamatsu Tatsuya
• Saiki Daisuke
• Teraoka Kazuhiro
• Yabuta Takashi

Classifications

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H01L21/6708 Primary

  Electricity · mapped topic