Methods of transferring electrically conductive materials

Patent metadata

Field	Value
Publication number	US-10219388-B2
Application number	US-201415033567-A
Country	US
Kind code	B2
Filing date	Oct 31, 2014
Priority date	Nov 1, 2013
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

First claim

The invention claimed is:

1. A method of transferring an electrically conductive material to a substrate, the method comprising:
a) contacting at least a portion of a non-planar substrate with a layered structure comprising:
(1) a dielectric material layer positioned over a carrier film;
(2) an electrically conductive material layer comprising the electrically conductive material positioned over the dielectric material layer; and
(3) an adhesive layer positioned over the electrically conductive material layer; and

b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material layer adheres to the substrate.

2. The method of claim 1 , further comprising c) removing the carrier film from the substrate after step b).

3. The method of claim 1 , wherein the electrically conductive material is applied in a pattern over at least a portion of the carrier film to form the electrically conductive material layer.

4. The method of claim 1 , wherein the layered structure further comprises a release coat layer positioned under the dielectric material layer.

5. The method of claim 1 , wherein a release coat layer is positioned over at least a portion of the carrier film, and the dielectric material layer is positioned over at least a portion of the release coat layer.

6. The method of claim 1 , wherein the electrically conductive material is applied over the carrier film after application of a dielectric material of the dielectric material layer and a material of a release coat layer, and the electrically conductive material is applied in a pattern on top of at least a portion of the dielectric material layer.

7. The method of claim 1 , wherein the layered structure further comprises a second electrically conductive material layer positioned under the dielectric material layer.

8. The method of claim 1 , wherein the layered structure further comprises a release coat layer, and wherein a decorative material is applied over at least a portion of one or more of the electrically conductive material layer, the release coat layer, the adhesive layer, the dielectric material layer, and the carrier film.

9. The method of claim 1 , wherein the layered structure further comprises a release coat layer and one or more of the release coat layer, the dielectric material layer, the electrically conductive material layer, and the adhesive layer is completely free of halogenated organic compounds.

10. The method of claim 1 , wherein the electrically conductive material layer comprises electrically conductive particles comprising nickel, iron, copper, zinc, chromium, cobalt, aluminum, silver, gold, iridium, platinum, palladium, zirconium, tin, carbon, or mixtures thereof.

11. The method of claim 10 , wherein the electrically conductive material layer further comprises a binder.

12. The method of claim 11 , wherein the binder is thermoplastic.

13. The method of claim 1 , wherein the electrically conductive material layer is completely free of silver-silver chloride.

14. The method of claim 1 , wherein the electrically conductive material layer forms an antenna on the substrate.

15. The method of claim 1 , wherein the substrate has a glass transition temperature of less than 150° C.

16. The method of claim 1 , wherein the electrically conductive material layer adhered to the substrate has a resistivity of less than 20 milliohms per square per mil, as determined by the resistivity measurement.

17. The method of claim 1 , wherein conductivity of the electrically conductive material layer increases after applying heat and pressure.

18. The method of claim 1 , wherein heat and pressure are applied to the substrate and carrier film for a period of time ranging from 1 to 20 seconds, at a temperature ranging from 300° F. to 450° F., and at a pressure ranging from 40 to 120 psi, such that the electrically conductive material adheres to the substrate.

19. A method of forming a layered structure for a heat stamping application comprising:
a) applying a material to form a release coat layer over at least a portion of a carrier film;
b) applying a dielectric material over the release coat layer to form a dielectric material layer;
c) drying the dielectric material layer for a period of time ranging from 1 to 120 seconds;
d) applying an electrically conductive material in a pattern over the dielectric material layer to form an electrically conductive material layer;
e) drying the electrically conductive material layer for a period of time ranging from 1 to 180 seconds;
f) applying an adhesive over at least a portion of the electrically conductive material layer to form an adhesive layer; and
g) drying the adhesive layer for a period of time ranging from 1 to 120 seconds,
wherein the layered structure is positioned over a non-planar substrate.

20. The method of claim 19 , further comprising applying a decorative material over at least a portion of one or more of the carrier film, release coat layer, dielectric material layer and electrically conductive material layer, and drying the decorative material for a period of time ranging from 1 to 120 seconds.

21. The method of claim 19 , wherein the layered structure is rolled after step g).

22. A method of transferring an electrically conductive material to a substrate, the method comprising:
a) forming a layered structure from a method comprising:
i) applying a material over at least a portion of a carrier film to form a release coat layer;
ii) applying a dielectric material over the release coat layer to form a dielectric material layer;
iii) drying the dielectric material layer;
iv) applying an electrically conductive material in a pattern over at least a portion of the dielectric material layer to form an electrically conductive material layer;
v) drying the electrically conductive material layer;
vi) applying an adhesive over at least a portion of the electrically conductive material layer to form an adhesive layer; and
vii) drying the adhesive layer;

b) contacting at least a portion of a non-planar substrate with the layered structure; and
c) applying heat and pressure to the substrate and layered structure for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material layer adheres to the substrate,
wherein conductivity of the electrically conductive material layer increases after applying heat and pressure.

23. The method of claim 22 , further comprising d) removing the carrier film from the substrate after step c).

24. The method of claim 22 , wherein the electrically conductive material layer adhered to the substrate has a resistivity of less than 20 milliohms per square per mil, as determined by the resistivity measurement.

Assignees

• Ppg Ind Ohio Inc
• Si Cal Tech Inc

Inventors

• Tyler Jaye
• Cheetham Paul F
• Burn Darren
• Mccollum Gregory J

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

• H05K3/207 Primary

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title