Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit

Patent metadata

Field	Value
Publication number	US-2016007477-A1
Application number	US-201414769574-A
Country	US
Kind code	A1
Filing date	Mar 6, 2014
Priority date	Mar 12, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

First claim

1 . A method for forming an electrically conductive ultrafine pattern, the method comprising:
(1) a step of applying a resin composition (a) to form a receiving layer (A) on a substrate; (2) a step of printing an ink (b) containing particles (b1) to be formed into plating cores by a reverse offset printing method to form a plating core pattern (B) on the receiving layer (A); and (3) a step of depositing a metal on the plating core pattern (B) formed in the step (2) by an electrolytic plating method.

2 . The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the resin composition (a) includes a urethane resin (a1) having a weight average molecular weight of 5,000 or more or a vinyl resin (a2), and a medium (a3).

3 . The method for forming an electrically conductive ultrafine pattern according to claim 2 , wherein the urethane resin (a1) has a hydrophilic group and 2,000 to 5,500 mmol/kg of an aliphatic cyclic structure with respect to the total mass.

4 . The method for forming an electrically conductive ultrafine pattern according to claim 2 , wherein the vinyl resin (a2) is a resin obtained by polymerization of a vinyl monomer mixture containing 10 to 70 percent by mass of methyl methacrylate and 10 to 50 percent by mass of an alkyl (meth)acrylate having an alkyl group with 2 to 12 carbon atoms.

5 . The method for forming an electrically conductive ultrafine pattern according to claim 2 , wherein the resin composition (a) includes composite resin particles each composed of a shell layer formed of the urethane resin (a1) and a core layer formed of the vinyl resin (a2).

6 . The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the particles (b1) to be formed into plating cores are metal nano particles having a volume average particle diameter (Mv) of 2 to 100 nm, and the metal nano particles are protected by an organic compound containing a basic nitrogen atom and are dispersed in the ink (b).

7 . The method for forming an electrically conductive ultrafine pattern according to claim 6 , wherein the urethane resin (a1) or the vinyl resin (a2) in the resin composition (a) has a functional group capable of performing a cross-linking reaction with the organic compound which contains a basic nitrogen atom and which protects the metal nano particles.

8 . The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the ink (b) further contains a fluorine-based surface energy control agent and/or a silicone-based surface energy control agent.

9 . The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the reverse offset printing method is a printing method comprising:
(i) forming a uniform ink film on a liquid-repellent surface of a blanket; (ii) pressing a relief plate on a surface of the ink film to remove an ink at a portion in contact with the relief plate; and (iii) then transferring an ink remaining on the blanket to an object on which printing is to be performed to form a targeted pattern.

10 . An electrically conductive ultrafine pattern formed by the pattern forming method according to claim 1 .

11 . An electric circuit comprising the electrically conductive ultrafine pattern according to claim 10 .

Assignees

• Dis Corp
• Dainippon Ink & Chemicals

Inventors

• Yoshihara Sunao
• Katsuta Haruhiko
• Katayama Yoshinori
• Shirakami Jun
• Murakawa Akira
• Fujikawa Wataru
• Saitou Yukie

Classifications

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title

• H05K2201/0257

  Nanoparticles · CPC title

• H05K2201/0224

  Conductive particles having an insulating coating · CPC title

• H05K3/246

  Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title