Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

Patent metadata

Field	Value
Publication number	US-10215775-B2
Application number	US-201514986500-A
Country	US
Kind code	B2
Filing date	Dec 31, 2015
Priority date	May 7, 2003
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

First claim

We claim:

1. A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising:
a) a first planarized layer comprising at least a first metal structural material;
b) a second planarized layer comprising at least a second metal structural material, wherein the second metal structural material is either directly adhered to the first metal material of the first planarized layer or is separated from the first metal material of the first planarized layer by one or more intermediate conductive layers or one or more depositions of a metal material;
c) a third planarized layer comprising at least a third metal structural material, wherein the third metal structural material is either directly adhered to the second planarized layer or is separated from the second planarized layer by one or more additional planarized intermediate conductive layers or by one or more depositions of metal material,
wherein the second planarized layer is located between the first and third planarized layers, and
wherein the second metal material is different from both the first metal material and the third metal material, and
wherein the compliant probe is configured to provide a compliant electrical contact element that provides a conductive path between the at least two electronic components.

2. The compliant probe of claim 1 additionally comprising a contact tip material forming part of at least one layer wherein the contact tip material is a different metal than that of the core structural material.

3. The compliant probe of claim 2 wherein the contact tip material is different from a structural material of the same layer.

4. The compliant probe of claim 3 wherein the layer including the contact tip material also includes a core material that is different from the contact tip material.

5. The compliant probe of claim 1 wherein the probe is a microscopic or mesoscopic structure.

6. The compliant probe of claim 1 wherein each of at least two layers comprise regions of core materials and shell materials.

7. A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising:
a) a first planarized layer comprising at least a first structural material;
b) a second planarized layer comprising at least a second structural material, wherein the second structural material is either directly adhered to the first planarized layer or is separated from the first planarized layer by one or more intermediate layers or one or more depositions of material;
c) a third planarized layer comprising at least a third structural material, wherein the third structural material is either directly adhered to the second planarized layer or is separated from the second planarized layer by one or more additional intermediate layers or one or more depositions of material,
wherein the second planarized layer is located between the first and third planarized layers, and
wherein the second material is different from both the first material and the third metal material, and
wherein the compliant probe is configured to provide a compliant electrical contact element that provides a conductive path between the at least two electronic components,
wherein each of at least one of the first to third planarized layers comprises at least one core structural material and at least one shell structural material, wherein the at least one core structural material and the at least one shell structural material of a respective layer corresponds to the respective first structural material, second structural material, or third structural material while the other of the shell structural material and core structural material do not, and wherein the shell structural material of a given layer and provides a shell that surrounds a bottom and sides of the core structural material of the given layer.

8. The compliant probe of claim 7 wherein the given layer comprises the second planarized layer and the core structural material comprises the second structural material of the second planarized layer and a shell structural material of the second planarized layer comprises a different material.

9. The compliant probe of claim 8 wherein the first and third structural materials and the shell structural material of the second planarized layer are similar materials.

10. The compliant probe of claim 9 wherein the same material comprises a material selected from the group consisting of (1) nickel (Ni), (2) copper (Cu), (3) beryllium copper (BeCu), (4) nickel phosphorous (Ni—P), (5) tungsten (W), (6) aluminum copper (Al—Cu), (7) steel, (8) P7 alloy, (9) palladium, (10) molybdenum, (11) manganese, (12) brass, (13) chrome, (14) chromium copper (Cr—Cu), and (15) combinations of these.

Assignees

• Univ Southern California

Inventors

• Wu Ming Ting
• Larsen Iii Rulon J
• Kim Young
• Kim Kieun
• Cohen Adam L
• Kumar Ananda H
• Lockard Michael S
• Smalley Dennis R

Classifications

• Y10T428/12486

  Laterally noncoextensive components [e.g., embedded, etc.] · CPC title

• G01R1/06761 Primary

  related to layers · CPC title

• B32B15/01 Primary

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title