Electric contact and socket for electrical part

Patent metadata

Field	Value
Publication number	US-9698511-B2
Application number	US-201214384033-A
Country	US
Kind code	B2
Filing date	Dec 27, 2012
Priority date	Mar 21, 2012
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An electric contact for preventing a terminal of an electrical part and the electric contact from sticking to each other after a continuity test to improve the durability of the electric contact; and a socket for electrical part using the electric contact. In the electric contact according to the preferred embodiment of the present invention, a foundation layer composed primarily of Ni, a surface layer composed primarily of Pd and Ag, and an outermost layer composed primarily of Sn or Au are formed on a surface of an electrically-conductive base material.

First claim

The invention claimed is:

1. An electric contact comprising:
an electrically-conductive base material;
a surface layer which comprises Pd and Ag, and is formed above the base material;
an outermost layer which comprises Sn and is directly formed on the surface layer; and
a barrier layer formed by melting of a specific amount of Sn in the outermost layer into the surface layer, wherein
the electric contact is in contact with an Sn-containing terminal of an electrical part when a continuity test of the electrical part is conducted in a high temperature environment under which Sn contained in the Sn-containing terminal of the electrical part melts, and
the barrier layer suppresses Sn contained in the Sn-containing terminal of the electrical part melted under the high temperature environment of the continuity test from being alloyed with Pd and Ag contained in the surface layer.

2. The electric contact according to claim 1 , wherein the Ag is included in the surface layer at a percent weight ratio higher than that of the Pd.

3. The electric contact according to claim 1 , wherein the surface layer includes a Pd—Ag plated layer.

4. The electric contact according to claim 1 , wherein the surface layer includes a laminate of a Pd—Ag plated layer and an Ag plated layer or a laminate of a Pd—Ag plated layer and a Pd plated layer.

5. The electric contact according to claim 1 , wherein the surface layer includes a laminate of an Ag plated layer and a Pd plated layer.

6. The electric contact according to claim 1 , wherein a foundation layer comprising Ni is formed on the base material, and the surface layer is formed on the foundation layer.

7. A socket for electrical part comprising:
a socket body;
a housing portion in which an electrical part provided with an Sn-containing terminal is housed when a continuity test of the electrical part is conducted in a high temperature environment under which Sn contained in the Sn-containing terminal of the electrical part melts; and
an electric contact disposed in the socket body and in contact with the terminal, wherein
the electric contact comprises:
an electrically-conductive base material;
a surface layer which comprises Pd and Ag, and is formed above the base material;
an outermost layer which comprises Sn, and is directly formed on the surface layer; and
a barrier layer formed by melting of a specific amount of Sn in the outermost layer into the surface layer, and

the barrier layer suppresses Sn contained in the Sn-containing terminal of the electrical part melted under the high temperature environment of the continuity test from being alloyed with Pd and Ag contained in the surface layer.

8. An electric contact comprising:
an electrically-conductive base material;
a surface layer which comprises Pd and Ag, and is formed above the base material; and
an outermost layer which comprises Au and is directly formed on the surface layer, wherein
the electric contact is in contact with an Sn-containing terminal of an electrical part when a continuity test of the electrical part is conducted in a high temperature environment under which Sn contained in the Sn-containing terminal of the electrical part melts, and
when the outermost layer is directly contacted with the Sn-containing terminal of the electrical part and the electrical part is operated in the high temperature environment, at least a part of Sn contained in the Sn-containing terminal is melted, which thereby forms an Sn—Au alloy, which is easier to delaminate than an alloy of Pd—Ag contained in the surface layer and Sn contained in the Sn-containing terminal of the electrical part, between the outermost layer and the Sn-containing terminal.

9. The electric contact according to claim 8 , wherein the Ag is included in the surface layer at a percent weight ratio higher than that of the Pd.

10. The electric contact according to claim 8 , wherein the surface layer includes a Pd—Ag plated layer.

11. The electric contact according to claim 8 , wherein the surface layer includes a laminate of a Pd—Ag plated layer and an Ag plated layer or a laminate of a Pd—Ag plated layer and a Pd plated layer.

12. The electric contact according to claim 8 , wherein the surface layer includes a laminate of an Ag plated layer and a Pd plated layer.

13. The electric contact according to any one of claim 8 , wherein a foundation layer comprising Ni is formed on the base material, and the surface layer is formed on the foundation layer.

14. A socket for electrical part comprising:
a socket body;
a housing portion in which an electrical part provided with an Sn-containing terminal is housed when a continuity test of the electrical part is conducted in a high temperature environment under which Sn contained in the Sn-containing terminal of the electrical part melts; and
an electric contact disposed in the socket body and in contact with the terminal, wherein
the electric contact comprises:
an electrically-conductive base material;
a surface layer which comprises Pd and Ag, and is formed above the base material; and
an outermost layer which comprises Au and is directly formed on the surface layer, and

wherein when the outermost layer is directly contacted with the Sn-containing terminal of the electrical part and the electrical part is operated in the high temperature environment, at least a part of Sn contained in the Sn-containing terminal is melted, which thereby forms an Sn—Au alloy, which is easier to delaminate than an alloy of Pd—Ag contained in the surface layer and Sn contained in the Sn-containing terminal of the electrical part, between the outermost layer and the Sn-containing terminal.

Assignees

• Enplas Corp

Inventors

• Oda Takahiro

Classifications

• H01R13/03 Primary

  characterised by the material, e.g. plating, or coating materials · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• C22C19/03

  based on nickel · CPC title

• C22C32/0021

  Matrix based on noble metals, Cu or alloys thereof · CPC title

• G01R1/06761

  related to layers · CPC title