Light emitting device
US-9478718-B2 · Oct 25, 2016 · US
US10211368B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10211368-B2 |
| Application number | US-201715587879-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 5, 2017 |
| Priority date | Sep 17, 2015 |
| Publication date | Feb 19, 2019 |
| Grant date | Feb 19, 2019 |
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In various embodiments, light-emitting devices incorporate graded layers with compositional offsets at one or both end points of the graded layer to promote formation of two-dimensional carrier gases and polarization doping, thereby enhancing device performance.
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What is claimed is: 1. An ultraviolet (UV) light-emitting device comprising: a substrate having an Al u Ga 1-u N top surface, wherein 0≤u≤1.0; an active, light-emitting device structure disposed over the substrate, the light-emitting device structure comprising a multiple-quantum well layer comprising a plurality of periods each comprising a strained Al x Ga 1-x N barrier and a strained Al y Ga 1-y N quantum well, x and y being different by an amount facilitating confinement of charge carriers in the multiple-quantum well layer; an electron blocking layer disposed over the multiple-quantum well layer, the electron blocking layer comprising Al v Ga 1-x N, wherein v>y and v>x; a graded Al z Ga 1-z N layer disposed over the electron blocking layer, a composition of the graded Al z Ga 1-z N layer being graded in Al concentration z such that the Al concentration z decreases in a direction away from the light-emitting device structure; a p-doped Al w Ga 1-w N cap layer disposed over the graded Al z Ga 1-z N layer, wherein 0≤w≤0.4; and a metallic contact disposed over the p-doped Al w Ga 1-w N cap layer and comprising at least one metal, wherein at an interface between the graded Al z Ga 1-z N layer and the electron blocking layer, the Al concentration z of the graded Al z Ga 1-z N layer is less than the Al concentration v of the electron blocking layer. 2. The device of claim 1 , wherein, at the interface between the graded Al z Ga 1-z N layer and the electron blocking layer, the Al concentration z of the graded Al z Ga 1-z N layer is less than the Al concentration v of the electron blocking layer by an amount no less than 0.03. 3. The device of claim 1 , wherein, at the interface between the graded Al z Ga 1-z N layer and the electron blocking layer, the Al concentration z of the graded Al z Ga 1-z N layer is less than the Al concentration v of the electron blocking layer by an amount no more than 0.85. 4. The device of claim 1 , wherein, at the interface between the graded Al z Ga 1-z N layer and the electron blocking layer, the Al concentration z of the graded Al z Ga 1-z N layer is less than the Al concentration v of the electron blocking layer by an amount no less than 0.03 and by an amount no more than 0.85. 5. The device of claim 1 , wherein 0.4≤u≤1.0. 6. The device of claim 1 , wherein 0≤w≤0.2. 7. The device of claim 1 , wherein the graded Al z Ga 1-z N layer is undoped. 8. The device of claim 1 , wherein a p-type dopant concentration within the graded Al z Ga 1-z N layer is less than 10 13 cm −3 . 9. The device of claim 1 , wherein the Al concentration z of the graded Al z Ga 1-z N layer at an interface between the graded Al z Ga 1-z N layer and the p-doped Al w Ga 1-w N cap layer is approximately equal to the Al concentration w of the p-doped Al w Ga 1-w N cap layer. 10. The device of claim 1 , wherein the Al concentration w of the p-doped Al w Ga 1-w N cap layer is approximately 0. 11. The device of claim 1 , wherein the substrate comprises doped or undoped AlN. 12. The device of claim 1 , wherein the UV light-emitting device comprises a light-emitting diode. 13. The device of claim 1 , wherein the UV light-emitting device comprises a laser. 14. The device of claim 1 , wherein a thickness of the p-doped Al w Ga 1-w N cap layer is no less than 1 nm and no greater than 50 nm. 15. The device of claim 1 , further comprising an n-doped Al n Ga 1-n N bottom contact layer disposed between the substrate and the multiple-quantum well layer, wherein y<n<x. 16. The device of claim 1 , further comprising a reflection layer disposed over at least a portion of the p-doped Al w Ga 1-w N cap layer, the reflection layer having a reflectivity to light emitted by the light-emitting device structure larger than a reflectivity to light emitted by the light-emitting device structure of the metallic contact. 17. The device of claim 16 , wherein the reflection layer comprises Al. 18. The device of claim 16 , further comprising a transmissive layer disposed between at least a portion of the reflection layer and the p-doped Al w Ga 1-w N cap layer, the transmissive layer having a transmissivity to light emitted by the light-emitting structure larger than a transmissivity to light emitted by the light-emitting structure of the metallic contact. 19. The device of claim 18 , wherein the transmissive layer comprises at least one of silicon oxide, silicon nitride, aluminum oxide, or gallium oxide. 20. An ultraviolet (UV) light-emitting device comprising: a substrate having an Al u Ga 1-u N top surface, wherein 0≤u≤1.0; an active, light-emitting device structure disposed over the substrate, the light-emitting device structure comprising a multiple-quantum well layer comprising a plurality of periods each comprising a strained Al x Ga 1-x N barrier and a strained Al y Ga 1-y N quantum well, x and y being different by an amount facilitating confinement of charge carriers in the multiple-quantum well layer; a graded Al z Ga 1-z N layer disposed over the multiple-quantum well layer, a composition of the graded Al z Ga 1-z N layer being graded in Al concentration z such that the Al concentration z decreases in a direction away from the light-emitting device structure; a p-doped Al w Ga 1-w N cap layer disposed over the graded Al z Ga 1-z N layer, wherein 0≤w≤0.4; and a metallic contact disposed over the p-doped Al w Ga 1-w N cap layer and comprising at least one metal, wherein at an interface between the graded Al z Ga 1-z N layer and the p-doped Al w Ga 1-w N cap layer, the Al concentration w of the p-doped Al w Ga 1-w N cap layer is less than the Al concentration z of the graded Al z Ga 1-z N layer. 21. The device of claim 20 , wherein, at the interface between the graded Al z Ga 1-z N layer and the p-doped Al w Ga 1-w N cap layer, the Al concentration w of the p-doped Al w Ga 1-w N cap layer is less than the Al concentration z of the graded Al z Ga 1-z N layer by an amount no less than 0.03. 22. The device of claim 20 , wherein, at the interface between the graded Al z Ga 1-z N layer and the p-doped Al w Ga 1-w N cap layer, the Al concentration w of the p-doped Al w Ga 1-w N cap layer is less than the Al concentration z of the graded Al z Ga 1-z N layer by an amount no more than 0.85. 23. The device of claim 20 , wherein, at the interface between the graded Al z Ga 1-z N layer and the p-doped Al w Ga 1-w N cap layer, the Al concentration w of the p-doped Al w Ga 1-w N cap layer is less than the Al concentration z of the graded Al z Ga 1-z N layer by an amount no less than 0.03 and by an amount no more than 0.85. 24. The device of claim 20 , wherein 0.4≤u≤1.0. 25. The device of claim 20 , wherein 0≤w≤0.2. 26. The device of claim 20 , wherein the graded Al z Ga 1-z N layer is undoped. 27. The device of claim 20 , wherein a p-type dopant concentration within the graded Al z Ga 1-z N layer is less than 10 13 cm −3 . 28. The device of claim 20 , further comprising, disposed between the multiple-quantum well layer and the graded Al z Ga 1-z N layer, an electron blocking layer comprising Al v Ga 1-v N, wherein v>y and v>x. 29. The device of claim 28 , wherein the Al concentration z of the graded Al z Ga 1-z N layer at an interface between the graded Al z Ga 1-z N layer and the electron blocking layer is approximately equal to the Al concentration v of the electron
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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