Laser processing apparatus

Patent metadata

Field	Value
Publication number	US-10207362-B2
Application number	US-201615205603-A
Country	US
Kind code	B2
Filing date	Jul 8, 2016
Priority date	Jul 17, 2015
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

A laser beam irradiation unit of laser processing apparatus includes a pulse laser beam oscillating unit, a condenser that condenses a pulse laser beam and emits the beam to a workpiece held by a chuck table, a dichroic mirror disposed between the pulse laser beam oscillating unit and the condenser, a strobe light irradiation unit that emits light to a path on which the dichroic mirror and the condenser are disposed, a beam splitter disposed between the strobe light irradiation unit and the dichroic mirror, and an imaging unit disposed on the path of light split by the beam splitter. A controller actuates the strobe light irradiation unit and the imaging unit according to the timing of the pulse laser beam, and detects the width of a laser-processed groove immediately after emission of the pulse laser beam on the basis of an image signal from the imaging unit.

First claim

What is claimed is:

1. A laser processing apparatus comprising:
a chuck table that holds a workpiece;
laser beam irradiating means that irradiates the workpiece held by the chuck table with a pulse laser beam;
X-axis direction moving means that moves the chuck table and the laser beam irradiating means relatively in an X-axis direction that is a processing feed direction;
Y-axis direction moving means that moves the chuck table and the laser beam irradiating means relatively in a Y-axis direction that is an indexing feed direction orthogonal to the X-axis direction; and
control means that controls the laser beam irradiating means, the X-axis direction moving means, and the Y-axis direction moving means,
wherein the laser beam irradiating means includes
pulse laser beam oscillating means that oscillates the pulse laser beam,
a condenser that condenses the pulse laser beam oscillated from the pulse laser beam oscillating means and emits the pulse laser beam to the workpiece held by the chuck table,
a dichroic mirror that is disposed between the pulse laser beam oscillating means and the condenser and reflects the pulse laser beam oscillated from the pulse laser beam oscillating means to lead the pulse laser beam to the condenser, the dichroic mirror allowing transmission of light having a wavelength other than a wavelength of the pulse laser beam through the dichroic mirror,
strobe light irradiating means that emits light to a path on which the dichroic mirror and the condenser are disposed,
a beam splitter that is disposed between the strobe light irradiating means and the dichroic mirror and splits light from the workpiece held by the chuck table, and
imaging means disposed on a path of light split by the beam splitter, and

the control means actuates the strobe light irradiating means and the imaging means according to timing of the pulse laser beam that is oscillated by the pulse laser beam oscillating means and is emitted to the workpiece held by the chuck table, and detects width of a laser-processed groove immediately after emission of the pulse laser beam on the basis of an image signal from the imaging means.

2. The laser processing apparatus according to claim 1 ,
wherein the control means stops actuation of the laser beam irradiating means to suspend processing if the detected width of the laser-processed groove is outside an allowable range.

3. The laser processing apparatus according to claim 1 ,
wherein the control means detects, on the basis of an image signal from the imaging means, the amount of deviation between a set value of Y-axis direction distance from a target that is set on the workpiece and is to identify a region in which processing should be carried out to the center of a laser-processed groove to be formed and Y-axis direction distance to the center of a laser-processed groove formed by irradiation with the pulse laser beam.

4. The laser processing apparatus according to claim 3 ,
wherein the control means controls the Y-axis direction moving means to correct a position irradiated with the pulse laser beam if the amount of deviation between the set value and the Y-axis direction distance to the center of the laser-processed groove formed by irradiation with the pulse laser beam surpasses an allowable value.

Assignees

• Disco Corp

Inventors

• Odagiri Wataru
• Iwamoto Taku
• Odanaka Kentaro
• Ohkubo Hironari
• Tsukiji Shuichiro
• Nehashi Kouichi
• Koerwer Joel

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P34/422

  using incoherent radiation · CPC title

• B23K2103/56

  being semiconducting · CPC title