Method for manufacturing circuit board and circuit board

Patent metadata

Field	Value
Publication number	US-10206287-B2
Application number	US-201415039949-A
Country	US
Kind code	B2
Filing date	Nov 28, 2014
Priority date	Nov 28, 2013
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

First claim

The invention claimed is:

1. A circuit board, comprising:
a substrate containing silicon at least at a surface;
a conductor layer containing aluminum, which is formed on the substrate; and
a mixed layer in which aluminum and silicon are present as being mixed, which is formed at an interface between the substrate and the conductor layer,
the substrate having a portion where the conductor layer has partially been removed such that the conductor layer forms a specific interconnection pattern on the substrate, and
in a cross-section in a direction perpendicular to the substrate, a ratio between a peak intensity found in energy dispersive X-ray analysis of an aluminum element derived from the conductor layer and a peak intensity found in energy dispersive X-ray analysis of a silicon element (a peak intensity of an aluminum element/a peak intensity of a silicon element) in a surface region of the substrate in the portion where the conductor layer has partially been removed being not more than one tenth,
wherein the surface of the substrate consists of a glass composition containing silicon.

2. The circuit board according to claim 1 , wherein a content of the aluminum element in the surface region of the substrate is not higher than 1000 ppm.

3. The circuit board according to claim 1 , wherein the mixed layer has a region of 5 nm or more where a value for detection of aluminum is not less than one tenth of a value for the detection of aluminum in the conductor layer and simultaneously a value for the detection of silicon is not less than one tenth of a value for detection of silicon in the substrate, in the case of observing change in concentration of aluminum and silicon at an interface between the conductor layer and the substrate by conducting energy dispersive X-ray spectrometry using an electron microscope on an observation region including the conductor layer and the substrate in the cross-section in the direction perpendicular to the substrate.

4. The circuit board according to claim 1 , wherein a thickness of the mixed layer is from 0.005 μm to 10 μm.

Assignees

• Toyo Aluminium Kk

Inventors

• Tsuji Kosuke
• Koike Kazunori
• Kawashima Katsura
• Tsuchiya Kenju
• Imai Shinji

Classifications

• H05K2203/0502

  Patterning and lithography · CPC title

• H05K1/032

  consisting of one material · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K3/067 Primary

  Etchants · CPC title

• H05K3/44

  Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)} · CPC title