Electronic fabric with incorporated chip and interconnect

Patent metadata

Field	Value
Publication number	US-10201081-B2
Application number	US-201715676519-A
Country	US
Kind code	B2
Filing date	Aug 14, 2017
Priority date	Dec 20, 2013
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

First claim

What is claimed is:

1. An electronic device comprising:
a flexible substrate configured to be mountable to a fabric layer;
one or more metallization layers deposited on the flexible substrate; and
one or more electronic components each electrically coupled to the one or more metallization layers with one or more releasable electrical connections,
wherein the one or more releasable electrical connections comprises at least one releasable input/output connections or releasable power/ground connections, wherein a form factor for the at least one of the releasable input/output connection and the releasable power/ground connections is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component.

2. The electronic device of claim 1 , further comprising a coating applied over at least one of one or more of the electronic components and at least a portion of the one or more metallization layers, wherein the coating is configured to provide at least one of mechanical protection and environmental protection to the one or more electronic components or to at least the portion of the one or more metallization layers to which the coating is applied.

3. The electronic device of claim 2 , wherein the coating comprises at least one of poly(p-xylylene), polystyrene, polymethylmethacrylate, polypropylene, ethylene-methyl methacrylate copolymer, polyether ether ketone, nylon, phenolic epoxy, ethylene tetrafluoroethylene, and post-consumer commingled polymer.

4. The electronic device of claim 1 , wherein the flexible substrate comprises at least one of a polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), a polycarbonate, glass, and Kapton.

5. The electronic device of claim 1 , wherein the one or more metallization layers comprise one or more interconnects for electrically connecting a first one of the one or more electronic components to at least one of a second one of the one or more electronic components and an external electronic device.

6. The electronic device of claim 1 , wherein the releasable connection between a first one of the one or more electronic components and the one or more metallization layers comprises at least one of a releasable connector, a releasable socket, and a releasable snapping configuration.

7. The electronic device of claim 1 , wherein the one or more electronic components comprise at least one of a sensor, a display component, a communication component, a processor, a memory, a system bus, and a power device.

8. A system comprising:
a fabric layer; and
an electronic device comprising;
a flexible substrate coupled to the fabric layer;
one or more metallization layers deposited on the flexible substrate; and
one or more electronic components each electrically coupled to the one or more metallization layers with one or more releasable connections,
wherein the one or more releasable connections comprises at least one releasable input/output connections or releasable power/ground connections, wherein a form factor for the at least one of the releasable input/output connection and the releasable power/ground connections is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component.

9. The system of claim 8 , further comprising a second fabric layer coupled to the fabric layer, wherein the electronic device is positioned between the fabric layer and the second fabric layer.

10. The system of claim 8 , wherein the electronic device further comprises a coating applied over at least one of one or more of the electronic components and at least a portion of the one or more metallization layers, wherein the coating is configured to provide at least one of mechanical protection and environmental protection to the one or more electronic components or to at least the portion of the one or more metallization layers to which the coating is applied.

11. The system of claim 10 , wherein the coating comprises at least one of poly(p-xylylene), polystyrene, polymethylmethacrylate, polypropylene, ethylene-methyl methacrylate copolymer, polyether ether ketone, nylon, phenolic epoxy, ethylene tetrafluoroethylene, and post-consumer commingled polymer.

12. The system of claim 8 , wherein the flexible substrate comprises at least one of a polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), a polycarbonate, glass, and Kapton.

13. The system of claim 8 , wherein the fabric layer forms at least part of an article of clothing, an article of luggage, or an article of furniture.

14. The system of claim 8 , wherein the electronic device comprises at least one of a sensor, a display device, a computer input device, a communication device, a processor, a memory, and a power device.

15. A system comprising:
an article comprising one or more fabric layers;
a plurality of electronic devices, each comprising;
a flexible substrate coupled to one of the one or more fabric layers;
one or more metallization layers deposited on the flexible substrate; and
one or more electronic components each electrically coupled to the one or more metallization layers with one or more releasable connections, wherein the one or more releasable connections comprises at least one releasable input/output connections or releasable power/ground connections, wherein a form factor for the at least one of the releasable input/output connection and the releasable power/ground connections is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component; and
one or more communication links between two or more of the plurality of electronic devices.

16. The system of claim 15 , wherein each of the one or more releasable connections comprises at least one of a releasable connector, a releasable socket, and a releasable snapping configuration.

17. The system of claim 15 , wherein the plurality of electronic devices comprise at least one of a sensor, a display device, a computer input device, a communication device, a processor, a memory, and a power device.

18. The system of claim 15 , wherein the one or more communication links comprises one or more of at least one wired communication link and at least one wireless communication link.

19. The system of claim 15 , wherein the article comprises a clothing article, a luggage article, or a furniture article.

Assignees

• Intel Corp

Inventors

• Jezewski Christopher
• Pillarisetty Ravi
• Doyle Brian

Classifications

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K2201/029

  Woven fibrous reinforcement or textile · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• D03D15/00

  Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used · CPC title