Imprint apparatus, and method of manufacturing article

Patent metadata

Field	Value
Publication number	US-10199244-B2
Application number	US-201514823075-A
Country	US
Kind code	B2
Filing date	Aug 11, 2015
Priority date	Aug 11, 2015
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

An imprint apparatus includes a substrate holder including a plurality of chucking regions for chucking a substrate, and a controller that controls chucking forces of the chucking regions. The chucking regions include a first chucking region for chucking a periphery of a first substrate having a first diameter, a second chucking region for chucking a periphery of a second substrate having a second diameter larger than the first diameter, a third chucking region group divided into a plurality of regions inside the first chucking region, and a fourth chucking region group divided into a plurality of regions between the first chucking region and the second chucking region. The controller controls the chucking forces of each of the chucking regions.

First claim

What is claimed is:

1. An imprint apparatus for imprinting a pattern on an imprint material on a substrate using a mold having the pattern, the imprint apparatus comprising:
a substrate holder including a plurality of chucking regions for chucking the substrate; and
a control unit configured to control chucking forces of the plurality of chucking regions,
wherein the plurality of chucking regions include:
a first chucking region having a first groove having a ring shape for chucking a periphery of a first substrate having a first diameter;
a second chucking region having a second groove having a ring shape for chucking a periphery of a second substrate having a second diameter larger than the first diameter, a diameter of the second groove being larger than a diameter of the first groove;
a first chucking region group having a plurality of chucking regions in a region surrounded by the first groove; and
a second chucking region group having a plurality of chucking regions in a region between the first groove and the second groove, and

wherein the control unit controls the chucking forces of the first groove, the second groove, the plurality of chucking regions of the first chucking region group, and the plurality of chucking regions of the second chucking region group.

2. The apparatus according to claim 1 , wherein the plurality of chucking regions of the first chucking region group has at least four chucking regions.

3. The apparatus according to claim 1 , wherein:
the first substrate has a shape enclosed with an arc having a central angle of not less than 180 degree, and a line connecting two ends of the arc, and
the first chucking region has a shape matching the shape of the first substrate.

4. The apparatus according to claim 1 , wherein:
the second substrate has a shape enclosed with an arc having a central angle of not less than 180 degree, and a line connecting two ends of the arc, and
the second chucking region has a shape matching the shape of the second substrate.

5. The apparatus according to claim 1 , wherein the first diameter is φ300 mm, and the second diameter is φ450 mm.

6. The apparatus according to claim 1 , wherein the chucking force is generated by a negative pressure between the chucking region and the substrate.

7. The apparatus according to claim 1 , wherein:
the plurality of chucking regions form spaces defined by partitions, and
the chucking force is obtained by a negative pressure generator configured to set the space at a negative pressure.

8. The apparatus according to claim 7 , wherein the substrate holder includes a plurality of posts that come in contact with the substrate, in at least one of the plurality of chucking regions.

9. The apparatus according to claim 1 , wherein the first chucking region and the second chucking region are concentrically arranged.

10. The apparatus according to claim 1 , wherein the control unit controls a chucking region as a chucking force control target among the plurality of chucking regions, in accordance with a position on the substrate where the pattern of the mold is to be formed on the imprint material by bringing the pattern of the mold into contact with the imprint material on the substrate.

11. A method of manufacturing an article, the method comprising steps of:
forming a pattern on an imprint material on a substrate using an imprint apparatus having a mold with the pattern; and
processing the substrate on which the pattern is formed in the preceding step,
wherein the imprint apparatus includes:
a substrate holder including a plurality of chucking regions for chucking the substrate; and
a control unit configured to control chucking forces of the plurality of chucking regions,
wherein the plurality of chucking regions include:
a first chucking region having a first groove having a ring shape for chucking a periphery of a first substrate having a first diameter;
a second chucking region having a second groove having a ring shape for chucking a periphery of a second substrate having a second diameter larger than the first diameter, a diameter of the second groove being larger than a diameter of the first groove;
a first chucking region group having a plurality of chucking regions in a region surrounded by the first groove; and
a second chucking region group having a plurality of chucking regions in a region between the first groove and the second groove, and

wherein the control unit controls the chucking forces of the first groove, the second groove, the plurality of chucking regions of the chucking region group, and the plurality of chucking regions of the second chucking region group.

Assignees

• Canon Kk

Inventors

• Kawahara Nobuto
• Miyajima Yoshikazu
• Ye Zhengmao
• Cherala Anshuman
• Choi Byung-Jin
• Lu Xiaoming
• Luo Kang

Classifications

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0448 Primary

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title