Wafer placement and gap control optimization through in situ feedback

Patent metadata

Field	Value
Publication number	US-10196741-B2
Application number	US-201414471884-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Jun 27, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.

First claim

What is claimed is:

1. An apparatus comprising:
a processing fixture comprising a processing fixture body having a processing fixture bottom surface, at least three openings in the processing fixture body;
at least three proximity sensors retained within at least three of the openings in the processing fixture body; and
a susceptor comprising a susceptor plate having a susceptor plate top surface, a susceptor center point, and one or more recesses formed in the susceptor plate top surface a distance R R from the susceptor center point;
wherein the susceptor plate top surface and the processing fixture bottom surface are substantially parallel, and the susceptor plate top surface is separated from the processing fixture bottom surface by a gap distance D G ; and
each of the at least three proximity sensors have an operative face substantially parallel to the susceptor plate top surface, and a first opening is located a distance R 1 from the susceptor center point, a second opening is located a distance R 2 from the susceptor center point, and a third opening is located a distance R 3 from the susceptor center point, R 2 =R R and R 1 >R 2 >R 3 , and the proximity sensors are capacitive displacement sensors with a sensitivity range of about 0.2 nm to about 28 nm for a gap distance range of about 0.1 mm to about 5.0 mm.

2. The apparatus of claim 1 , wherein the processing fixture body comprises four openings and four proximity sensors retained within the four openings, wherein the fourth opening is located a distance R 4 from the susceptor center point, and R 2 >R 4 >R 3 .

3. The apparatus of claim 1 , which further comprises a controller in electrical communication with the at least three proximity sensors, where the controller receives electrical signals over an electrical path and determines the distances between the at least three proximity sensors and surface features below the at least three proximity sensors and provides an alarm if the distances are outside of an intended range; and
the susceptor further comprises a support post which defines an axis of rotation for the susceptor.

4. The apparatus of claim 1 , wherein the at least three openings and at least three proximity sensors retained within the at least three openings are arranged in the processing fixture in a straight line, so that the proximity sensors may detect bowing of the susceptor.

5. The apparatus of claim 1 , wherein the at least three openings and at least three proximity sensors retained within the at least three openings are arranged in the processing fixture in a triangular pattern, so that the proximity sensors may provide measurements for detecting tilting of the susceptor.

6. The apparatus of claim 1 , wherein the processing fixture is an injector for atomic layer deposition comprising at least eleven channels, where at least three of the channels deliver a purge gas, and the at least three openings and at least three proximity sensors are located within purge gas channels.

7. The apparatus of claim 1 , wherein the processing fixture is an injector for atomic layer deposition comprising at least eleven channels, where at least three of the channels deliver a purge gas, at least six channels are under vacuum to evacuate gases, and a wall separates adjacent channels, and the at least three openings and at least three proximity sensors are located within the walls between a purge gas channel and a vacuum channel.

8. An apparatus comprising:
a processing fixture comprising a processing fixture body having a processing fixture top surface, a processing fixture bottom surface opposite the processing fixture top surface, a thickness between the processing fixture top surface and the processing fixture bottom surface, and three or more openings in the processing fixture bottom surface;
a susceptor comprising
a susceptor plate having a susceptor plate top surface, a susceptor plate bottom surface opposite the susceptor plate top surface, a thickness between the susceptor plate top surface and the susceptor plate bottom surface, and one or more recesses in the susceptor plate top surface, wherein the susceptor plate top surface and the processing fixture bottom surface are substantially parallel, and the susceptor plate top surface is separated from the processing fixture bottom surface by a gap distance D G ; and
a support post affixed to the susceptor plate that defines an axis of rotation of the susceptor, wherein the one or more recesses in the susceptor plate top surface are a distance R R from the axis of rotation;

three or more capacitive displacement sensors that measures the gap distance, wherein each of the three or more capacitive displacement sensors are retained within one of the three or more openings in the processing fixture bottom surface, each of the three or more capacitive displacement sensors have an operative face substantially parallel to the susceptor plate top surface, and each of the capacitive displacement sensors have a sensitivity range of about 0.2 nm to about 28 nm for a gap distance range of about 0.1 mm to about 5.0 mm; and
wherein a first of the three or more capacitive displacement sensors is located a distance R 1 from the axis of revolution, a second of the three or more capacitive displacement sensors is located a distance R 2 from the axis of revolution, and a third of the three or more capacitive displacement sensors is located a distance R 3 from the axis of revolution, wherein R 2 =R R and R 1 >R 2 >R 3 .

9. A method comprising:
rotating a susceptor around an axis of rotation, the susceptor comprising a top surface and one or more recesses a distance R R from the axis of rotation;
measuring a gap distance D G between an operative face of a capacitive displacement sensor within a processing fixture bottom surface and the top surface of the susceptor at at least three radial distances from the axis of rotation using at least three capacitive displacement sensors retained within at least three openings in the processing fixture bottom surface, a first opening is located a distance R 1 from the axis of rotation, a second opening is located a distance R 2 from the axis of rotation, and a third opening is located a distance R 3 from the axis of rotation, R 2 =R R R 1 >R 2 >R 3 , and the capacitive displacement sensors have a sensitivity range of about 0.2 nm to about 28 nm for a gap distance range of about 0.1 mm to about 5.0 mm;
detecting changes in the gap distance as the susceptor rotates around the axis of rotation; and
determining the position of one or more surface features from the gap distances measured at the at least three radial distances from the axis of rotation.

10. The method of claim 9 , which further comprises establishing a baseline gap distance by measuring the gap distance at a reference point.

11. The method of claim 10 , which further comprises comparing the measured gap distance to the baseline gap distance and detecting an increase in the gap distance to identify a leading edge of the one or more recesses as the susceptor rotates.

12. The method of claim 11 , which further comprises identifying the presence of a wafer in at least one of the one or more recesses by detecting a gap distance that is larger than the baseline gap distance, but less than the depth of the recess.

13. The method of claim 12 , which further comprises determining whether the wafer is at least partially outside of a recess by detecting a gap distance that increases or decreases linearly as the susceptor rotates.

14. The method of claim 12 , which further comprises storing the baseline gap distance and me

Assignees

• Applied Materials Inc

Inventors

• Griffin Kevin
• Ravid Abraham
• Minkovich Alex
• Khandelwal Somesh
• Yudovsky Joseph
• Egan Todd

Classifications

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title

• H10P72/0608 Primary

  of substrates stored in a container, a magazine, a carrier, a boat or the like · CPC title

• C23C16/45544

  characterized by the apparatus · CPC title