Chip resistor

Patent metadata

Field	Value
Publication number	US-10192659-B2
Application number	US-201615572847-A
Country	US
Kind code	B2
Filing date	Apr 11, 2016
Priority date	May 11, 2015
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate 2; a resistor body 4 that is provided between and connected to the two front electrodes 3; a protective layer 5 that covers the resistor body 4; a pair of back electrodes 6 that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate 2; end-surface electrodes 7 through which the front electrodes 3 and the back electrodes 6 are electrically conductively connected to each other respectively; external electrodes 8 that cover the end-surface electrodes 7; and a pair of insulating resin layers 9 that are provided to cover edge portions of the back electrodes 6; wherein: the pair of insulating resin layers 9 are opposed to each other with interposition of a predetermined interval therebetween on the back surface of the ceramic substrate 2; and at least opposed side end portions of the insulating resin layers 9 are exposed from the external electrodes 8.

First claim

The invention claimed is:

1. A chip resistor comprising: a ceramic substrate that is shaped like a cuboid; a pair of front electrodes that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate; a resistor body that is provided between and connected to the pair of front electrodes; a protective layer that covers the resistor body; a pair of back electrodes that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate; end-surface electrodes through which the front electrodes and the back electrodes are electrically conductively connected to each other respectively; and external electrodes that cover the end-surface electrodes; wherein:
a pair of insulating resin layers are formed on the back surface of the ceramic substrate with interposition of a predetermined interval therebetween so as to cover edge portions of the back electrodes; and at least opposed side end portions of the insulating resin layers are exposed from the external electrodes.

2. A chip resistor according to claim 1 , wherein: the end-surface electrodes are formed on regions of the back electrodes except the edge portions thereof so as to be connected to the insulating resin layers.

3. resistor according to claim 2 , wherein: the insulating resin layers are formed like belts to extend from one widthwise end portions of the back surface of the ceramic substrate to the other widthwise end portions of the back surface of the ceramic substrate.

Assignees

• Koa Corp

Inventors

• Akahane Yasushi
• Chihara Shinsuke

Classifications

• H01C7/00

  Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00) · CPC title

• H01C1/148 Primary

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C1/142

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title

• H01C7/003

  Thick film resistors · CPC title