Removing photoresist from a wafer

Patent metadata

Field	Value
Publication number	US-10191379-B2
Application number	US-201715606883-A
Country	US
Kind code	B2
Filing date	May 26, 2017
Priority date	Jun 14, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.

First claim

The invention claimed is:

1. A method for removing photoresist off of a wafer, comprising:
moving a wafer having a photoresist film into a bath of a process liquid in a process tank, with the process liquid removing the photoresist film from the wafer, and with some of the removed photoresist film comprising solids;
pumping process liquid from the process tank to a filter assembly having filter media;
moving the process liquid through the filter media, with the filter media filtering out the solids from the process liquid;
returning the filtered process liquid to the process tank;
scraping the filter media, by rotating a rotor within a filter chamber formed by the filter media, with the rotor having blades contacting the filter media, to move the filtered out solids to a collector in the filter assembly;
removing the filtered out solids from the collector; and
removing the wafer from the process tank.

2. The method of claim 1 comprising pumping the process liquid using a semi-enclosed impeller pump.

3. The method of claim 1 comprising moving the process liquid through the filter media via a pump exerting positive fluid pressure on the process liquid within the filter assembly.

4. The method of claim 1 with multiple wafers in the process tank at the same time.

5. The method of claim 4 including loading a plurality of wafers onto a tank rotor in the process tank and rotating the tank rotor to sequentially move each wafer through the process tank.

6. The method of claim 1 comprising removing the filtered out solids from the collector by opening a purge valve connected to the collector.

7. The method of claim 6 comprising moving the filtered out solids from the collector, through the purge valve and into a recovery unit, and separating process liquid from the solids in the recovery unit.

8. The method of claim 6 wherein the process liquid comprises a solvent heated to 80 to 120° C.

9. A system for removing photoresist off of a wafer, comprising:
a process tank for holding a process liquid which chemically reacts with the photoresist to remove the photoresist off of the wafer;
a filter assembly connected to the process tank via a supply line and a return line;
at least one pump for pumping process liquid from the process tank to the filter assembly and back to the process tank;
filter media in the filter assembly adapted for filtering out solids from the process liquid, with the filter media comprising a vertically oriented cylinder having a cylindrical filter chamber, the supply line connected to an inlet at an upper end of the filter chamber, an annular return chamber surrounding the filter media, and the return line connected to an outlet adjacent to a lower end of the return chamber;
a scraper movable along the filter media to remove filtered out solids from the filter media, the scraper including a rotor within a filter chamber formed by the filter media, with the rotor having blades contacting the filter media, and a motor for rotating the rotor; and
a purge valve at a lower end of the filter assembly for purging accumulated solids out of the filter assembly.

10. The system of claim 9 further including a recovery unit connected to the purge valve.

11. The system of claim 9 with the at least one pump comprising a semi-enclosed impeller pump.

12. A method for removing photoresist off of a wafer, comprising:
moving a wafer having a photoresist film into a bath of a process liquid in a process tank, with the process liquid removing the photoresist film from the wafer, and with some of the removed photoresist film comprising solids;
pumping process liquid from the process tank into an upper end of a filter chamber in a filter assembly, the filter chamber formed by a cylinder of filter media;
moving the process liquid radially outward through the filter media and into an annular return chamber surrounding the filter media, with the filter media filtering out the solids from the process liquid;
returning the filtered process liquid to the process tank via an outlet adjacent to a lower end of the return chamber;
scraping the filter media to move the filtered out solids to a collector in the filter assembly;
removing the filtered out solids from the collector; and
removing the wafer from the process tank.

13. The method of claim 12 including scraping the filter media, by rotating a rotor within a filter chamber formed by the filter media, with the rotor having blades contacting the filter media.

Assignees

• Applied Materials Inc

Inventors

• Mchugh Paul R
• Hanson Kyle Moran
• Klocke John L
• Bergman Eric J
• Crane Stuart
• Wilson Gregory J

Classifications

• G03F7/2008

  characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/3092

  Recovery of material; Waste processing · CPC title

• G03F7/422 Primary

  using liquids only (G03F7/421 takes precedence) · CPC title

• H10P70/54

  Cleaning of wafer edges · CPC title