Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module

Patent metadata

Field	Value
Publication number	US-10189703-B2
Application number	US-201615362556-A
Country	US
Kind code	B2
Filing date	Nov 28, 2016
Priority date	Apr 28, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

First claim

The invention claimed is:

1. A transducer module, comprising:
a supporting substrate having a first side, a second side, and a recess;
a cap coupled to the first side of the supporting substrate to form a first chamber and a second chamber, the second chamber being internally isolated from the first chamber;
a first sensor chip coupled to the first side of the supporting substrate in the first chamber, the first sensor chip integrating a first MEMS transducer configured to detect a first environmental quantity and to generate a first transduced signal as a function of the first environmental quantity detected;
a second sensor chip coupled to the first side of the supporting substrate in the second chamber, the second sensor chip integrating a second MEMS transducer configured to detect a second environmental quantity and to generate a second transduced signal as a function of the second environmental quantity detected; and
a control chip arranged in the recess of the supporting substrate, the control chip including a first surface that is exposed in the first chamber and a second surface that is exposed in the second chamber, the control chip being functionally coupled to the first and second MEMS transducers and configured to receive, in use, the first and the second transduced signals.

2. The transducer module according to claim 1 , wherein the cap has a partition wall internally isolating the first and second chambers from each other, the first and second chambers being delimited by respective regions of the substrate, the cap, control chip, and the partition wall.

3. The transducer module according to claim 1 , wherein the control chip is coupled to the supporting substrate by a fixing structure laterally surrounding the control chip.

4. The transducer module according to claim 3 , wherein the fixing structure frames the control chip, and a surface of the control chip is coplanar with the first side of the supporting substrate.

5. The transducer module according to claim 4 , wherein the control chip includes first contact pads electrically coupled to the first sensor chip and second contact pads electrically coupled to the second sensor chip.

6. The transducer module according to claim 5 , wherein the control chip has a thickness substantially equal to a thickness of the supporting substrate.

7. The transducer module according to claim 3 , wherein the control chip has a thickness smaller than that of the supporting substrate and the fixing structure is cup-shaped.

8. The transducer module according to claim 3 , wherein the cap has a partition wall that internally isolates the second chamber from the first chamber, wherein the partition wall is coupled to a surface of the control chip.

9. The transducer module according to claim 1 , wherein said supporting substrate includes dielectric layers of interwoven glass fibers in an epoxy-resin matrix, or FR4.

10. The transducer module according to claim 1 , wherein the first MEMS transducer and the second MEMS transducer are chosen in the group comprising: an acoustic transducer, a pressure transducer, a light-radiation sensor, a UV sensor, an IR sensor, an acceleration sensor, and a gyroscope.

11. The transducer module according to claim 1 , wherein the first sensor chip is an acoustic transducer and the supporting substrate has a first through opening at the first chamber that forms a sound port of the acoustic transducer, and wherein the cap has a second through opening at the second chamber to form an access path to the second sensor chip for detecting the second environmental quantity to be transduced in the group comprising: an acoustic wave, UV radiation, IR radiation, visible light, an ambient pressure.

12. A transducer module comprising:
a supporting substrate having a first side and a second side;
a cap coupled to the first side of the supporting substrate to form a first chamber and a second chamber, the second chamber being internally isolated from the first chamber;
a first sensor chip coupled to the first side of the supporting substrate in the first chamber, the first sensor chip integrating a first MEMS transducer configured to detect a first environmental quantity and to generate a first transduced signal as a function of the first environmental quantity detected;
a second sensor chip coupled to the first side of the supporting substrate in the second chamber, the second sensor chip integrating a second MEMS transducer configured to detect a second environmental quantity and to generate a second transduced signal as a function of the second environmental quantity detected;
a control chip arranged in the supporting substrate, the control chip at least partially exposed in at least one of the first chamber and in the second chamber, the control chip being functionally coupled to the first and second MEMS transducers and configured to receive, in use, the first and the second transduced signals,
wherein the cap defines, with the supporting substrate, a third chamber internally isolated from the first and second chambers, the third chamber housing a third sensor chip integrating a third MEMS transducer configured to detect a third environmental quantity and generate a third transduced signal as a function of the third environmental quantity detected,
a third through via passing through the supporting substrate that forms an electrical connection between a portion of the first side in the third chamber and the second side of the supporting substrate;
a fourth through via passing through the supporting substrate that forms an electrical connection between a respective portion of the first side in the second chamber and the second side of the supporting substrate; and
a conductive path on the second side of the supporting substrate in electrical connection with the third and fourth through vias,
wherein the third sensor chip is electrically coupled to the third through via, and the control chip is electrically coupled to the fourth through via.

13. The transducer module according to claim 12 , wherein the control chip is coupled to the first side of the supporting substrate and exposed completely in the first chamber.

14. The transducer module according to claim 12 , wherein the control chip comprises an ASIC.

15. A method of manufacturing a transducer module, comprising the steps of:
coupling a first sensor chip to a first side of a supporting substrate, wherein the first sensor chip integrates a first MEMS transducer configured to detect a first environmental quantity and generate a first transduced signal as a function of the first environmental quantity detected;
coupling a second sensor chip to the first side of the supporting substrate, wherein the second sensor chip integrates a second MEMS transducer configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected;
placing a control chip in a recess in the supporting substrate, a surface of the control chip aligned with the first side of the supporting substrate;
coupling the control chip to both the first and second MEMS transducers for receiving, in use, the first and second transduced signals, respectively; and
coupling a cap to the first side of the supporting substrate, the cap being configured to define, with the supporting substrate, a first chamber and a second chamber internally isolated from one another, the first sensor chip being located first chamber, the second sensor chip being located in the second chamber.

16. The method according to claim 15 comprising coupling the c

Assignees

• St Microelectronics Srl

Inventors

• Ghidoni Marco Omar
• Brioschi Roberto

Classifications

• H04R19/005

  using semiconductor materials · CPC title

• H04R1/406

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• B81C2203/00

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• B81C2201/01

  in or on a substrate · CPC title

• B81C1/0023

  Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261) · CPC title