Microphone

Patent metadata

Field	Value
Publication number	US-9736596-B2
Application number	US-201514946000-A
Country	US
Kind code	B2
Filing date	Nov 19, 2015
Priority date	Jul 7, 2015
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A microphone includes a case including a plurality of sound holes; a first sound device installed at positions corresponding to at least two sound holes in the case; a second sound device spaced apart from the first sound device in the case and installed at a position corresponding to at least one sound hole; and a semiconductor chip electrically connected to the first sound device and the second sound device, where the at least two sound holes formed in the positions corresponding to the first sound device are each formed in upper and lower surfaces of the case on the basis of the first sound device.

First claim

What is claimed is:

1. A microphone comprising:
a case in which a plurality of sound holes are formed;
a first sound device mounted in the case and installed at a position corresponding to at least two sound holes formed in an upper surface and a lower surface of the case, respectively;
a second sound device mounted in the case, installed to be spaced apart from the first sound device by a predetermined interval, and installed at a position corresponding to another sound hole formed in the case; and
a semiconductor chip electrically connected to the first sound device and the second sound device,
wherein the first sound device receives sound source signals through each of the at least two sound holes formed in the upper and lower surfaces of the case and transmits a first sound output signal, which is a bi-directional signal, to the semiconductor chip, and
the semiconductor chip receives a second sound output signal, which is an omnidirectional signal, from the second sound device, and outputs a final sound signal, which is a uni-directional signal, using the first sound output signal and the second sound output signal.

2. The microphone of claim 1 , wherein:
the first sound device and the second sound device are omnidirectional sound devices.

3. The microphone of claim 1 , wherein:
the semiconductor chip is electrically connected to each of the first sound device and the second sound device by a wire.

4. The microphone of claim 1 , wherein:
the semiconductor chip is positioned on the second sound device.

5. The microphone of claim 1 , wherein:
each of the first sound device and the second sound device includes a substrate, a vibration membrane formed over the substrate, and a fixed membrane formed over the vibration membrane to be spaced apart from the vibration membrane by a predetermined interval;
a first contact hole formed in the substrate of the first sound device;
a second contact hole formed in the substrate of the second sound device; and
a first connection part and a second connection part formed in the first contact hole and the second contact hole, respectively.

6. The microphone of claim 5 , wherein:
the case further includes an electrode line that electrically connects the first connection part and the second connection part to each other.

7. The microphone of claim 6 , wherein:
the semiconductor chip is electrically connected to the second sound device through a bonding part on the second sound device.

8. The microphone of claim 7 , wherein:
the electrode line and the bonding part are formed of the same material.

9. A microphone comprising:
a first sound device receiving a sound source signal and outputting a first sound output signal;
a second sound device formed to be spaced apart from the first sound device by a predetermined interval, receiving the sound source signal and outputting a second sound output signal;
a case in which the first sound device and the second sound device are positioned, a first sound hole and a second sound hole are formed in an upper side and a lower side of the first sound device, respectively, and a third sound hole is formed in a position corresponding to the second sound device; and
a semiconductor chip positioned on the second sound device and outputting a final sound signal based on the first sound output signal and the second sound output signal,
wherein the first sound device receives the sound source signal through each of the first sound hole and the second sound hole and transmits the first sound output signal, which is a bi-directional signal, to the semiconductor chip, and
the second sound device receives the sound source signal through the third sound hole and transmits the second sound output signal, which is an omnidirectional signal, to the semiconductor chip.

10. The microphone of claim 9 , wherein:
the semiconductor chip outputs the final sound signal, which is a uni-directional signal, using the first sound output signal and the second sound output signal.

11. A microphone comprising:
a case in which a first sound hole and a second sound hole are formed in an upper side and lower side, respectively, and a third sound hole is formed;
a first sound device positioned between the first sound hole and the second sound hole in the case;
a second sound device formed at a position corresponding to the third sound hole in the case; and
a semiconductor chip positioned on the second sound device,
wherein each of the first sound device and the second sound device includes a substrate, a vibration membrane formed over the substrate, and a fixed membrane formed over the vibration membrane to be spaced apart from the vibration membrane by a predetermined interval, and
the first sound device and the second sound device are electrically connected to each other through a first connection part and a second connection part formed in the respective substrates.

12. The microphone of claim 11 , wherein:
the first connection part and the second connection part are each formed in a first contact hole and a second contact hole formed in the first sound device and the second sound device.

13. The microphone of claim 12 , wherein:
the case further includes an electrode line that electrically connects the first connection part and the second connection part to each other.

14. The microphone of claim 11 , wherein:
the semiconductor chip is electrically connected to the second sound device through a bonding part on the second sound device.

Assignees

• Hyundai Motor Co Ltd

Inventors

• Kim Hyunsoo
• Yoo Ilseon

Classifications

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R1/406

  microphones · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R2410/01

  Noise reduction using microphones having different directional characteristics · CPC title

• H04R3/005

  for combining the signals of two or more microphones (specially adapted for hearing aids H04R25/407) · CPC title