Detector unit for detector array of radiation imaging modality

US10185043B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10185043-B2
Application numberUS-201515745186-A
CountryUS
Kind codeB2
Filing dateSep 18, 2015
Priority dateJul 17, 2015
Publication dateJan 22, 2019
Grant dateJan 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A single side contact ball-grid array (BGA) package for a radiation detector array, the single side contact BGA package comprising: a routing layer; an analog-to-digital (A/D) converter configured to convert an analog signal to a digital signal, the A/D converter coupled to the routing layer; a shielding element disposed between the routing layer and the A/D converter and configured to shield the A/D converter from radiation; and a molding compound surrounding the shielding element and the A/D converter. 2. The single side contact BGA package of claim 1 , wherein the molding compound is in contact with the routing layer. 3. The single side contact BGA package of claim 1 , comprising a second analog-to-digital (A/D) converter disposed below the A/D converter. 4. The single side contact BGA package of claim 3 , comprising a spacer disposed between the A/D converter and a second A/D converter.

Assignees

Inventors

Classifications

  • G01T1/244Primary

    Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like · CPC title

  • Analogue/digital converters ({H03M1/001 – } H03M1/10 take precedence) · CPC title

  • between stacked chips · CPC title

  • characterised by the relative positions of pads or connectors relative to package parts · CPC title

  • Electricity · mapped topic

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What does patent US10185043B2 cover?
Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converte…
Who is the assignee on this patent?
Analogic Corp
What technology area does this patent fall under?
Primary CPC classification G01T1/244. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).