Detector unit for detector array of radiation imaging modality
US-2018210096-A1 · Jul 26, 2018 · US
US10185043B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10185043-B2 |
| Application number | US-201515745186-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 18, 2015 |
| Priority date | Jul 17, 2015 |
| Publication date | Jan 22, 2019 |
| Grant date | Jan 22, 2019 |
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Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.
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What is claimed is: 1. A single side contact ball-grid array (BGA) package for a radiation detector array, the single side contact BGA package comprising: a routing layer; an analog-to-digital (A/D) converter configured to convert an analog signal to a digital signal, the A/D converter coupled to the routing layer; a shielding element disposed between the routing layer and the A/D converter and configured to shield the A/D converter from radiation; and a molding compound surrounding the shielding element and the A/D converter. 2. The single side contact BGA package of claim 1 , wherein the molding compound is in contact with the routing layer. 3. The single side contact BGA package of claim 1 , comprising a second analog-to-digital (A/D) converter disposed below the A/D converter. 4. The single side contact BGA package of claim 3 , comprising a spacer disposed between the A/D converter and a second A/D converter.
Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like · CPC title
Analogue/digital converters ({H03M1/001 – } H03M1/10 take precedence) · CPC title
between stacked chips · CPC title
characterised by the relative positions of pads or connectors relative to package parts · CPC title
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