Method of manufacturing a light emitting device and thin film forming apparatus
US-9412948-B2 · Aug 9, 2016 · US
US10177335B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10177335-B2 |
| Application number | US-201715485733-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2017 |
| Priority date | Mar 23, 2011 |
| Publication date | Jan 8, 2019 |
| Grant date | Jan 8, 2019 |
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An EL light-emitting element in which a lower electrode layer, an EL layer, and an upper electrode layer are stacked is formed on a substrate, and a wiring is formed on a counter substrate. Further, the substrate and the counter substrate are bonded so that the wiring is in physical contact with the upper electrode layer of the EL element. Accordingly, the wiring can serve as an auxiliary wiring for increasing conductivity of the upper electrode layer. With such an auxiliary wiring, a potential drop due to the resistance of the upper electrode layer can be suppressed even in the light-emitting device whose light-emitting portion is large.
Opening claim text (preview).
What is claimed is: 1. A light-emitting device comprising: a first substrate; a light-emitting element over the first substrate, the light-emitting element including at least a lower electrode layer, a light-emitting compound layer, and an upper electrode layer stacked in this order; a second substrate over the light-emitting element; and a structural body over the second substrate, wherein the structural body includes a first lens array over the second substrate and a second lens array over and in direct contact with the first lens array, wherein the second lens array has a different diameter from the first lens array, wherein a lens of the second lens array covers at least two lenses of the first lens array, and wherein a focal surface of the structural body with respect to visible light does not cross the light-emitting element. 2. The light-emitting device according to claim 1 , wherein the first substrate is formed of a metal or an alloy, and wherein a surface of the first substrate comprises an oxide of the metal or the alloy. 3. The light-emitting device according to claim 1 , wherein the light-emitting device is incorporated in one of an interior lighting device and a desk lamp. 4. The light-emitting device according to claim 1 , wherein the first lens array and the second lens array are configured to make a region that does not emit light more inconspicuous when the light emitted from the light-emitting element is seen from a second substrate side. 5. The light-emitting device according to claim 1 , wherein a direction of the second lens array is along a direction of the first lens array. 6. The light-emitting device according to claim 1 , further comprising a wiring over the light-emitting element, wherein the wiring is in direct contact with the upper electrode layer, and wherein the second substrate is over and in direct contact with the wiring. 7. The light-emitting device according to claim 1 , wherein the upper electrode layer is in direct contact with a side surface of the light-emitting compound layer. 8. The light-emitting device according to claim 1 , wherein the upper electrode layer includes a material having a property of transmitting light. 9. The light-emitting device according to claim 1 , further comprising a wiring over the first substrate and a planarization film over the wiring, wherein the upper electrode layer is electrically connected to the wiring through a contact hole in the planarization film. 10. A light-emitting device comprising: a first substrate; a light-emitting element over the first substrate, the light-emitting element including at least a lower electrode layer, a light-emitting compound layer, and an upper electrode layer stacked in this order; a second substrate over the light-emitting element; and a structural body over the second substrate, wherein the structural body includes a first lens array over the second substrate and a second lens array over and in direct contact with the first lens array, wherein a lens of the second lens array covers at least two lenses of the first lens array, and wherein a focal surface of the structural body with respect to visible light does not cross the light-emitting element. 11. The light-emitting device according to claim 10 , wherein the first substrate is forming of a metal or an alloy, and wherein a surface of the first substrate comprises an oxide of the metal or the alloy. 12. The light-emitting device according to claim 10 , wherein the light-emitting device is incorporated in one of an interior lighting device and a desk lamp. 13. The light-emitting device according to claim 10 , wherein the first lens array and the second lens array are configured to make a region that does not emit light more inconspicuous when the light emitted from the light-emitting element is seen from a second substrate side. 14. The light-emitting device according to claim 10 , wherein a direction of the second lens array is along a direction of the first lens array. 15. The light-emitting device according to claim 10 , further comprising a wiring over the light-emitting element, wherein the wiring is in direct contact with the upper electrode layer, and wherein the second substrate is over and in direct contact with the wiring. 16. The light-emitting device according to claim 10 , wherein the upper electrode layer is in direct contact with a side surface of the light-emitting compound layer. 17. The light-emitting device according to claim 10 , wherein the upper electrode layer includes a material having a property of transmitting light. 18. The light-emitting device according to claim 1 , further comprising a wiring over the first substrate and a planarization film over the wiring, wherein the upper electrode layer is electrically connected to the wiring through a contact hole in the planarization film.
Layouts of interconnections · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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