Method of manufacturing a light emitting device and thin film forming apparatus

Patent metadata

Field	Value
Publication number	US-9412948-B2
Application number	US-201514626122-A
Country	US
Kind code	B2
Filing date	Feb 19, 2015
Priority date	Dec 28, 2000
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

A method of manufacturing a light emitting device is provided in which satisfactory image display can be performed by the investigation and repair of short circuits in defect portions of light emitting elements. A backward direction electric current flows in the defect portions if a reverse bias voltage is applied to the light emitting elements having the defect portions. Emission of light which occurred from the backward direction electric current flow is measured by using an emission microscope, specifying the position of the defect portions, and short circuit locations can be repaired by irradiating a laser to the defect portions, turning them into insulators.

First claim

What is claimed is:

1. A method of manufacturing a light emitting device comprising the steps of:
forming a light emitting element including a first electrode over a first side of a substrate, a light emitting layer over the first electrode, and a second electrode over the light emitting layer;
applying a bias to the light emitting element;
determining a defect portion of the light emitting element;
irradiating the defect portion of the light emitting element with a laser; and
forming an insulating film on the light emitting element after the irradiation of the laser.

2. A method of manufacturing a light emitting device according to claim 1 , wherein the bias is a reverse bias.

3. A method of manufacturing a light emitting device according to claim 1 , wherein the defect portion is physically separated from the light emitting element by the irradiation of the laser.

4. A method of manufacturing a light emitting device according to claim 1 , wherein the defect portion is made into an insulator by the irradiation of the laser.

5. A method of manufacturing a light emitting device according to claim 1 , wherein the bias is applied in a range of 1 to 15 V.

6. A method of manufacturing a light emitting device according to claim 1 , wherein the insulating film comprises at least one of silicon nitride, silicon oxide and a diamond like carbon film.

7. A method of manufacturing a light emitting device according to claim 1 , wherein the defect portion is determined by an emission microscope.

8. A method of manufacturing a light emitting device comprising the steps of:
forming a first electrode over a first side of a substrate;
disposing the substrate in a film formation chamber so that the first side of the substrate faces down,
forming a light emitting layer adjacent to the first electrode by evaporation in the film formation chamber;
forming a second electrode over the light emitting layer;
applying a bias between the first electrode and the second electrode;
determining a defect portion of the light emitting layer as a result of applying the bias; and
irradiating the defect portion with a laser.

9. A method of manufacturing a light emitting device according to claim 8 , wherein the bias is a reverse bias.

10. A method of manufacturing a light emitting device according to claim 8 , wherein the defect portion of the light emitting layer is physically separated by the irradiation of the laser.

11. A method of manufacturing a light emitting device according to claim 8 , wherein the defect portion is made into an insulator by the irradiation of the laser.

12. A method of manufacturing a light emitting device according to claim 8 , wherein the defect portion is determined by an emission microscope.

13. A method of manufacturing a light emitting device according to claim 8 , wherein the bias is applied in a range of 1 to 15 V.

14. A method of manufacturing a light emitting device according to claim 8 , further comprising a step of forming an insulating film on the light emitting element after the irradiation of the laser.

15. A method of manufacturing a light emitting device according to claim 8 , wherein the insulating film comprises at least one of silicon nitride, silicon oxide and a diamond like carbon film.

16. A method of manufacturing a light emitting device comprising the steps of:
forming a light emitting element including a first electrode over a first side of a substrate, a light emitting layer over the first electrode and a second electrode over the light emitting layer;
applying a bias between the first electrode and the second electrode;
determining a defect portion of the light emitting element as a result of applying the bias; and
irradiating the defect portion with a laser from a second side of the substrate opposite to the first side through the substrate.

17. A method of manufacturing a light emitting device according to claim 16 , wherein the bias is a reverse bias.

18. A method of manufacturing a light emitting device according to claim 16 , wherein the defect portion of the light emitting element is physically separated by the irradiation of the laser.

19. A method of manufacturing a light emitting device according to claim 16 , wherein the defect portion is made into an insulator by the irradiation of the laser.

20. A method of manufacturing a light emitting device according to claim 16 , wherein the defect portion is determined by an emission microscope.

21. A method of manufacturing a light emitting device according to claim 16 , wherein the bias is applied in a range of 1 to 15 V.

22. A method of manufacturing a light emitting device according to claim 16 , further comprising a step of forming an insulating film on the light emitting element after the irradiation of the laser.

23. A method of manufacturing a light emitting device according to claim 22 , wherein the insulating film comprises at least one of silicon nitride, silicon oxide and a diamond like carbon film.

Assignees

• Semiconductor Energy Lab

Inventors

• Yamagata Hirokazu
• Adachi Yoshimi
• Shibata Noriko

Classifications

• Y10T428/31504

  Composite [nonstructural laminate] · CPC title

• H10K71/70

  Testing, e.g. accelerated lifetime tests · CPC title

• H10K85/00 Primary

  Organic materials used in the body or electrodes of devices covered by this subclass · CPC title

• H01L51/56

  Electricity · mapped topic

• H01L2251/568

  Electricity · mapped topic