Electronic component module with leads and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10176909-B2
Application number	US-201815884846-A
Country	US
Kind code	B2
Filing date	Jan 31, 2018
Priority date	Sep 25, 2015
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

An electronic component module with leads includes an electronic component including terminal electrodes at both ends of the electronic component body, and first and second leads including metal wires covered with insulating members and arranged side-by-side, the first and second leads are electrically connected to the terminal electrodes, wherein exposed metal wire portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes, the exposed metal wire portion of the first lead and the exposed metal wire portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction, the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder.

First claim

What is claimed is:

1. An electronic component module with leads, comprising:
an electronic component including a body and terminal electrodes at both ends of the body; and
first and second leads including metal wires covered with insulating members and arranged side-by-side; wherein
the first and second leads are electrically connected to the terminal electrodes, respectively;
metal wire exposed portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side used to join to the terminal electrodes, and the metal wire exposed portion of the first lead and the metal wire exposed portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction;
the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder;
the insulating member of the first lead extends between the metal wire exposed portion of the first lead and an end portion of the first lead adjacent to the metal wire exposed portion of the first lead; and
the insulating member of the second lead extends between the metal wire exposed portion of the second lead and an end portion of the second lead adjacent to the metal wire exposed portion of the second lead.

2. The electronic component module with leads according to claim 1 , wherein the electronic component is provided with a predetermined angle between a length direction of the electronic component and the lead length direction.

3. The electronic component module with leads according to claim 1 , wherein the electronic component is structured that a length direction of the electronic component is parallel or substantially parallel to the lead length direction.

4. The electronic component module with leads according to claim 1 , wherein an area of the exposed metal wire portions of the first and second leads is equal to or greater than a joining area of the terminal electrodes and the corresponding exposed metal wire portions, respectively.

5. The electronic component module with leads according to claim 1 , wherein the exposed metal wire portions of the first and second leads respectively extends to an outer peripheral side of the corresponding the leads, toward non-adjacent outer directions of the first and second leads.

6. The electronic component module with leads according to claim 1 , wherein an end surface of the first lead to mount one end of the electronic component and an end surface of the second lead to mount one end of the electronic component are not aligned with each other and are not continuous.

7. The electronic component module with leads according to claim 6 , wherein the end surface of the first lead to mount one end of the electronic component is protruded as compared with the end surface of the second lead to mount one end of the electronic component.

8. The electronic component module with leads according to claim 1 , wherein an insulating material is provided between the metal wire exposed portions.

9. The electronic component module with leads according to claim 8 , wherein the insulating material covers a portion of the metal wire exposed portions.

10. The electronic component module with leads according to claim 8 , wherein the insulating material does not cover the metal wire exposed portions.

11. The electronic component module with leads according to claim 8 , wherein the insulating material extends to a side wall of the electronic component between two of the terminal electrodes.

12. The electronic component module with leads according to claim 8 , wherein the first and second leads and the electronic component are fixed to each other by the insulating material.

13. The electronic component module with leads according to claim 1 , wherein a plurality of the electronic components are mounted on the first lead and the second lead at a predetermined interval.

14. The electronic component module with leads according to claim 1 , wherein the electronic component is a thermistor.

15. The electronic component module with leads according to claim 14 , wherein the thermistor is a surface-mount thermistor.

16. The electronic component module with leads according to claim 15 , wherein the surface-mount thermistor includes an internal electrode.

17. A method of manufacturing an electronic component module with leads, for mounting an electronic component including terminal electrodes at both ends of the electronic component body onto first and second leads which are formed by covering metal wires with insulating members and arranged side-by-side, the method comprising:
forming metal wire exposed portions where metal wires are exposed respectively from the first and second leads on joint surfaces of the first and second leads on a same side and for joining to the terminal electrodes, and spacing the metal wire exposed portion of the first lead and the metal wire exposed portion of the second lead apart from each other by a predetermined interval in a lead length direction;
applying solder to the metal wire exposed portions of the first and second leads, respectively; and
bringing the terminal electrodes into contact with the solder of the metal wire exposed portions of the first and second leads, respectively, and heating the solder to melt so that the terminal electrodes are respectively joined to the metal wire exposed portions of the first and second leads; wherein
the insulating member of the first lead extends between the metal wire exposed portion of the first lead and an end portion of the first lead adjacent to the metal wire exposed portion of the first lead; and
the insulating member of the second lead extends between the metal wire exposed portion of the second lead and an end portion of the second lead adjacent to the metal wire exposed portion of the second lead.

18. The method of manufacturing an electronic component module with leads according to claim 17 , wherein the electronic component is provided with a predetermined angle between a length direction of the electronic component and the lead length direction.

19. The method of manufacturing an electronic component module with leads according to claim 17 , wherein the electronic component is formed such that a length direction of the electronic component is parallel or substantially parallel to the lead length direction.

20. The method of manufacturing an electronic component module with leads according to claim 17 , further comprising a step of applying an insulating material between the metal wire exposed portions of the first and second leads.

21. The method of manufacturing an electronic component module with leads according to claim 20 , wherein when the insulating material is applied between the metal wire exposed portions, the insulating material also covers a portion of the metal wire exposed portions.

22. A method of manufacturing an electronic component module with leads, for mounting an electronic component including terminal electrodes at both ends of the electronic component body onto first and second leads which are formed by covering metal wires with insulating members and arranged side-by-side, the method comprising:
applying an insulating material to joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes and a periphery thereof;
removing the insulating members and the insulating material for formin

Assignees

• Murata Manufacturing Co

Inventors

• Zhou Jie
• Hamuro Yoshimitsu
• Tsubaki Shuji

Classifications

• H01C1/144

  the terminals or tapping points being welded or soldered · CPC title

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title

• G01K7/223

  characterised by the shape of the resistive element · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01C17/28 Primary

  adapted for applying terminals · CPC title