Horizontal cavity surface emitting laser integration features for heat assisted magnetic recording

US10176833B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10176833-B1
Application numberUS-201715408637-A
CountryUS
Kind codeB1
Filing dateJan 18, 2017
Priority dateJan 22, 2016
Publication dateJan 8, 2019
Grant dateJan 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A folded lasing cavity comprises at least one bend. The folded lasing cavity is disposed on and configured to emit light along a substrate-parallel plane. An etched facet is on an emitting end of the folded lasing cavity and an etched mirror is on another end of the folding lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substrate-parallel plane.

First claim

Opening claim text (preview).

What is claimed is: 1. A laser comprising: a folded lasing cavity comprising at least one bend, the folded lasing cavity disposed on and configured to emit light along a substrate-parallel plane; an etched facet on an emitting end of the folded lasing cavity and an etched mirror on another end of the folded lasing cavity; and an etched shaping mirror that redirects light received from the etched facet in a direction normal to the substrate-parallel plane, wherein the folded lasing cavity is uniformly cooled below the folded lasing cavity. 2. The laser of claim 1 , further comprising a grid of electrically conductive bumps on one side of the laser, a first portion of the bumps positioned over and coupled to the folded lasing cavity being configured as anode connections and a second portion of the bumps not positioned over the folded lasing cavity being configured as cathode connections. 3. The laser of claim 2 , wherein the electrically conductive bumps are configured to provide alignment of the laser with an optical input coupler of a slider. 4. The laser of claim 2 , wherein the etched shaping mirror is substantially centered with respect to the first portion of the bumps. 5. The laser of claim 2 , wherein the etched shaping mirror is offset with respect to the first portion of the bumps. 6. The laser of claim 1 , wherein the folded lasing cavity is formed by using etched reflective surfaces to direct the light. 7. The laser of claim 1 , wherein the folded lasing cavity comprises three or more bends such that at least two portions of the folding cavity laser are aligned and parallel with one another. 8. The laser of claim 1 , wherein at least one of the at least one bends is a right angle. 9. The laser of claim 1 , wherein at least one of the at least one bends comprises a curve.

Assignees

Inventors

Classifications

  • G11B5/4866Primary

    the arm comprising an optical waveguide, e.g. for thermally-assisted recording · CPC title

  • Optical waveguide in or on flying head · CPC title

  • with a special facet structure, e.g. structured, non planar, oblique · CPC title

  • Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive (G11B5/484 takes precedence; details of head housings or structures G11B5/10, G11B5/127; adjustment relative to the record carrier G11B5/56) · CPC title

  • Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

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What does patent US10176833B1 cover?
A folded lasing cavity comprises at least one bend. The folded lasing cavity is disposed on and configured to emit light along a substrate-parallel plane. An etched facet is on an emitting end of the folded lasing cavity and an etched mirror is on another end of the folding lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substr…
Who is the assignee on this patent?
Seagate Technology Llc
What technology area does this patent fall under?
Primary CPC classification G11B5/4866. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).