Bond pad sharing for powering a multiplicity of electrical components

Patent metadata

Field	Value
Publication number	US-10176832-B2
Application number	US-201815869361-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Oct 10, 2013
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

First claim

What is claimed is:

1. A method, comprising:
biasing a plurality of electrical bond pads of a recording transducer, the plurality of electrical bond pads coupled to a plurality of electrical components of the recording transducer;
at least one of the plurality of electrical bond pads is a shared electrical bond pad coupled to at least two of the plurality of electrical components; and
operating at least one of the plurality of electrical components alternately with respect to at least one another of the plurality of electrical components.

2. The method of claim 1 , wherein operating at least some of the plurality of electrical components alternately comprises operating the at least two of the electrical components alternately with respect to one another.

3. The method of claim 1 , wherein the plurality of electrical components comprises disparate electrical components.

4. The method of claim 1 , wherein:
the plurality of electrical components comprises at least two readers and at least one contact sensor; and
the contact sensor and one of the at least two readers are coupled to the shared electrical bond pad.

5. The method of claim 4 , wherein:
the one reader coupled to the shared electrical bond pad is configured to operate at times when the contact sensor is not operating; and
the other of the at least two readers is configured to operate at times when the contact sensor is operating.

6. The method of claim 4 , wherein the slider comprises a dummy contact sensor coupled to the one of the at least two readers coupled to the shared electrical bond pad.

7. The method of claim 1 , wherein:
the plurality of electrical components comprises three readers; and
the three readers are coupled to the shared electrical bond pad.

8. The method of claim 1 , wherein
the plurality of electrical components comprises a writer; and
the writer is coupled between one of the electrical bond pads and a ground.

9. The method of claim 1 , wherein:
the plurality of electrical components comprises a writer heater and at least two readers; and
the writer heater and one of the at least two readers are coupled to the shared electrical bond pad.

10. The method of claim 1 , wherein the plurality of electrical components comprises three readers, and pairs of the three readers are coupled to one of three shared electrical bond pads.

11. The method of claim 1 , wherein:
the plurality of electrical components comprises a writer heater and a reader heater; and
the writer heater and reader heater are coupled to the shared electrical bond pad.

12. The method of claim 11 , wherein:
the writer heater and reader heater are coupled in parallel between the two shared electrical bond pads; and
each of the writer and reader heaters is coupled in series to a respective diode, the writer and reader heaters configured to operate alternately depending on the direction of current flow between the two shared electrical bond pads.

13. The method of claim 1 , wherein:
the plurality of electrical components comprises a writer; and
the writer is coupled between one of the electrical bond pads and a ground.

14. The method of claim 1 , wherein:
the plurality of electrical components comprises a writer heater; and
the writer heater and the at least two readers are coupled to the shared electrical bond pad.

15. A method, comprising:
biasing a plurality of electrical bond pads of a recording transducer, the plurality of electrical bond pads coupled to a plurality of electrical components of the recording transducer, the plurality of electrical components comprising at least two readers;
at least one of the plurality of electrical bond pads is a shared electrical bond pad coupled to the at least two readers; and
operating at least some of the plurality of electrical components coupled to the shared electrical bond pad alternately with respect to one another.

16. The method of claim 15 , wherein:
the plurality of electrical components comprises three readers; and
the shared electrical bond pad is coupled to two of the readers.

17. The method of claim 15 , wherein:
the plurality of electrical components comprises three readers; and
the shared electrical bond pad is coupled to the three readers.

18. A method comprising:
coupling a plurality of electrical bond pads of a recording transducer to a plurality of electrical components of the recording transducer, the plurality of electrical components comprising at least three readers, a first reader and a second reader of the three readers are coupled to the shared electrical bond pad and a third reader of the three readers is coupled to one of the plurality of electrical components via a second shared electrical bond pad of the plurality of electrical bond pads; and
operating at least some of the plurality of electrical components coupled to the shared electrical bond pad alternately with respect to one another.

19. The method of claim 18 , wherein the third reader is coupled to a contact sensor via the second shared electrical bond pad.

20. The method of claim 19 , wherein the third reader coupled to the second shared electrical bond pad is configured to operate at times when the contact sensor is not operating.

Assignees

• Seagate Technology Llc

Inventors

• Gadbois Jason Bryce
• Macken Declan
• Klarqvist Karsten

Classifications

• G11B5/4976

  Disposition of heads, e.g. matrix arrangement · CPC title

• G11B5/4886

  relative to rotating disc · CPC title

• G11B2005/0008

  Magnetic conditionning of heads, e.g. biasing · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/4853 Primary

  Constructional details of the electrical connection between head and arm · CPC title