Bond pad sharing for powering multiple heaters of a magnetic recording head

Patent metadata

Field	Value
Publication number	US-9905255-B1
Application number	US-201715415165-A
Country	US
Kind code	B1
Filing date	Jan 25, 2017
Priority date	Feb 1, 2016
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A slider of a magnetic recording head comprises a ground pad and a plurality of electrical bond pads coupled to bias sources. A component of the slider is coupled between first and second bond pads. A first heater of the slider is coupled between the first bond pad and the ground pad. A second heater of the slider is coupled between the second bond pad and the ground pad. A first diode is disposed on the slider and coupled in series with the first heater. A second diode is disposed on the slider and coupled in series with the second heater.

First claim

What is claimed is:

1. An apparatus, comprising:
a slider of a magnetic recording head comprising a ground pad and a plurality of electrical bond pads coupled to bias sources;
a component of the slider coupled between first and second bond pads;
a first heater of the slider coupled between the first bond pad and the ground pad;
a second heater of the slider coupled between the second bond pad and the ground pad;
a first diode disposed on the slider and coupled in series with the first heater; and
a second diode disposed on the slider and coupled in series with the second heater.

2. The apparatus of claim 1 , wherein the component comprises a reader heater.

3. The apparatus of claim 1 , wherein the component comprises a reader.

4. The apparatus of claim 1 , wherein the component comprises a contact sensor.

5. The apparatus of claim 1 , wherein the component comprises a bolometer.

6. The apparatus of claim 1 , wherein:
the slider further comprise a first writer and a second writer;
the first heater comprises a first writer heater situated proximate the first writer; and
the second heater comprises a second writer heater situated proximate the second writer.

7. The apparatus of claim 6 , wherein the component comprises a reader heater.

8. The apparatus of claim 6 , wherein the component comprises a reader.

9. The apparatus of claim 6 , wherein the component comprises a contact sensor.

10. The apparatus of claim 1 , wherein:
the first heater comprises a writer heater; and
the second heater comprises a reader heater.

11. The apparatus of claim 10 , wherein the component comprises a contact sensor.

12. The apparatus of claim 1 , further comprising:
a first Zener diode disposed on the slider and coupled between the first diode and the ground pad; and
a second Zener diode disposed on the slider and coupled between the second diode and the ground pad.

13. The apparatus of claim 1 , wherein:
a threshold voltage of the first diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the first bond pad and the threshold voltage of the first diode; and
a threshold voltage of the second diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the second bond pad and the threshold voltage of the second diode.

14. The apparatus of claim 1 , wherein the slider is configured for heat-assisted magnetic recording and further comprises an optical waveguide and a near-field transducer.

15. An apparatus, comprising:
a slider of a magnetic recording head comprising a ground pad, a plurality of electrical bond pads coupled to bias sources, a first writer having a wide write pole, and a second writer having a narrow write pole relative to that of the first writer;
a component of the slider coupled between first and second bond pads;
a first heater of the slider coupled between the first bond pad and the ground pad, the first heater situated proximate the first writer and configured to thermally actuate the first writer;
a second heater of the slider coupled between the second bond pad and the ground pad, the second heater situated proximate the second writer and configured to thermally actuate the second writer;
a first diode disposed on the slider and coupled in series with the first heater; and
a second diode disposed on the slider and coupled in series with the second heater.

16. The apparatus of claim 15 , further comprising:
a first Zener diode disposed on the slider and coupled between the first diode and the ground pad; and
a second Zener diode disposed on the slider and coupled between the second diode and the ground pad.

17. The apparatus of claim 15 , wherein the component comprises a reader heater or a reader.

18. The apparatus of claim 15 , wherein the component comprises a contact sensor or a bolometer.

19. The apparatus of claim 15 , wherein:
a threshold voltage of the first diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the first bond pad and the threshold voltage of the first diode; and
a threshold voltage of the second diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the second bond pad and the threshold voltage of the second diode.

20. The apparatus of claim 15 , wherein the slider is configured for heat-assisted magnetic recording and further comprises an optical waveguide and a near-field transducer.

21. An apparatus, comprising:
a slider of a magnetic recording head comprising a ground pad and a plurality of electrical bond pads coupled to bias sources;
a first component of the slider coupled between first and second bond pads;
a first heater of the slider coupled between the first bond pad and the ground pad;
a second heater of the slider coupled between the second bond pad and the ground pad;
a first diode disposed on the slider and coupled in series with the first heater;
a second diode disposed on the slider and coupled in series with the second heater;
a second component of the slider coupled between third and fourth bond pads;
a third heater of the slider coupled between the fourth bond pad and the ground pad; and
a third diode disposed on the slider and coupled in series with the third heater.

22. The apparatus of claim 21 , further comprising:
a first Zener diode disposed on the slider and coupled between the first diode and the ground pad;
a second Zener diode disposed on the slider and coupled between the second diode and the ground pad; and
a third Zener diode disposed on the slider and coupled between the third diode and the ground pad.

23. The apparatus of claim 21 , wherein:
a threshold voltage of the first diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the first bond pad and the threshold voltage of the first diode;
a threshold voltage of the second diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the second bond pad and the threshold voltage of the second diode; and
a threshold voltage of the third diode is established such that a fluctuation in a mean-zero ground potential at the ground pad is less than a sum of a voltage at the fourth bond pad and the threshold voltage of the third diode.

Assignees

• Seagate Technology Llc

Inventors

• Ramakrishnan Narayanan
• Macken Declan
• Gadbois Jason Bryce

Classifications

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/607

  using thermal means · CPC title

• G11B5/4853 Primary

  Constructional details of the electrical connection between head and arm · CPC title

• G11B5/3133

  including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title

• G11B5/6076

  Detecting head-disk contact · CPC title