Bond pad sharing for powering a multiplicity of electrical components of a recording head

Patent metadata

Field	Value
Publication number	US-9607640-B2
Application number	US-201514812041-A
Country	US
Kind code	B2
Filing date	Jul 29, 2015
Priority date	Jul 29, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

An apparatus includes a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad. Each of a plurality of electrical components of the slider is coupled to at least one of the electrical bond pads. At least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components. At least one diode is coupled to at least one of the electrical bond pads and at least one of the electrical components.

First claim

What is claimed is:

1. An apparatus, comprising:
a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad;
a plurality of electrical components of the slider each coupled to at least one of the electrical bond pads;
at least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components;
a first electrical component is coupled between first and second electrical bond pads;
a second electrical component is coupled between the second electrical bond pad and a ground pad of the slider;
at least one diode is coupled to the second electrical bond pad and the second electrical component; and
the first and second components are energized alternately depending on the polarity of the first and second electrical bond pads.

2. The apparatus of claim 1 , wherein:
the first electrical component is a thermal sensor; and
the second electrical component is a heater situated proximate a reader.

3. The apparatus of claim 1 , wherein:
the first electrical component is a thermal sensor; and
the second electrical component is a heater situated proximate a writer.

4. The apparatus of claim 1 , wherein:
the first electrical component is a reader of the slider; and
the second electrical component is a heater situated proximate a writer.

5. The apparatus of claim 1 , wherein:
a reader is coupled between first and second electrical bond pads;
a heater situated proximate a writer is coupled between the second electrical bond pad and the ground pad of the slider;
a first diode is coupled to the second electrical bond pad and the writer heater;
a thermal sensor is coupled between third and fourth electrical bond pads;
a heater situated proximate a reader is coupled between the fourth electrical bond pad and a ground pad of the slider; and
a second diode is coupled to the fourth electrical bond pad and the reader heater.

6. The apparatus of claim 5 , wherein:
the reader and the writer heater are energized alternately depending on the polarity of the first and second electrical bond pads; and
the thermal sensor and the reader heater are energized alternately depending on the polarity of the third and fourth electrical bond pads.

7. The apparatus of claim 5 , wherein the writer heater and the reader heater are arranged to be energized concurrently.

8. The apparatus of claim 1 , wherein:
at least the first and second electrical components are coupled in parallel between the first and second electrical bond pads.

9. The apparatus of claim 1 , wherein:
the first electrical component and the second electrical components are coupled in parallel between the first electrical bond pad and the second electrical bond pad;
a first diode is coupled to the first electrical component;
a second diode is coupled to the second electrical component; and
the first and second diodes are arranged to conduct alternately depending on the polarity of the first and second electrical bond pads.

10. The apparatus of claim 1 , wherein:
the first electrical component is a thermal sensor; and
the second electrical component is a bolometric sensor.

11. The apparatus of claim 1 , further comprising a Zener diode coupled between the at least one diode and the second electrical bond pad.

12. An apparatus, comprising:
a slider of a heat-assisted magnetic recording head comprising:
a near-field transducer proximate an optical waveguide;
a reader and a writer, the writer situated proximate the near-field transducer;
a plurality of electrical bond pads coupled to bias sources and a ground pad;
a plurality of electrical components of the slider each coupled to at least one of the electrical bond pads;

at least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components;
a first electrical component is coupled between first and second electrical bond pads;
a second electrical component is coupled between the second electrical bond pad and a ground pad of the slider;
at least one diode is coupled to the second electrical bond pad and the second electrical component; and
the first and second components are energized alternately depending on the polarity of the first and second electrical bond pads.

13. The apparatus of claim 12 , wherein:
the first electrical component is a thermal sensor; and
the second electrical component is one of a heater situated proximate the reader and a heater situated proximate the writer.

14. The apparatus of claim 12 , wherein:
the first electrical component is a reader of the slider; and
the second electrical component is a heater situated proximate the writer.

15. The apparatus of claim 12 , wherein:
at least the first and second electrical components are coupled in parallel between the first and second electrical bond pads.

16. The apparatus of claim 12 , wherein:
the first electrical component and the second electrical component are coupled in parallel between the first electrical bond pad and the second electrical bond pad;
a first diode is coupled to the first electrical component;
a second diode is coupled to the second electrical component; and
the first and second diodes are arranged to conduct alternately depending on the polarity of the first and second electrical bond pads.

17. The apparatus of claim 16 , wherein:
the first electrical component is a thermal sensor; and
the second electrical component is a bolometric sensor.

18. The apparatus of claim 12 , further comprising a Zener diode coupled between the at least one diode and the second electrical bond pad.

Assignees

• Seagate Technology Llc

Inventors

• Macken Declan
• Gadbois Jason Bryce
• Stoebe Timothy William
• Ramakrishnan Narayanan

Classifications

• G11B5/4853 Primary

  Constructional details of the electrical connection between head and arm · CPC title

• G11B5/314

  where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

• G11B5/6005 Primary

  Specially adapted for spacing from a rotating disc using a fluid cushion · CPC title

• G11B5/012

  Recording on, or reproducing or erasing from, magnetic disks (G11B17/00, G11B19/00 take precedence) · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title