Method for electrical coupling and electric coupling arrangement

Patent metadata

Field	Value
Publication number	US-10170445-B2
Application number	US-201514933951-A
Country	US
Kind code	B2
Filing date	Nov 5, 2015
Priority date	May 26, 2015
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

First claim

The invention claimed is:

1. A method for electrically coupling a pad and a front face of a pillar, comprising:
shaping the front face of the pillar, the front face having at least partially a convex surface;
applying a suspension to the front face of the pillar or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles suspended within the carrier fluid and electrically conducting nanoparticles suspended within the carrier fluid, wherein the suspension is applied as a droplet that adheres to the front face of the pillar or to the pad with surface tension;
arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad;
evaporating the carrier fluid thereby concurrently confining each of the microparticles and the nanoparticles, and thereby concurrently arranging the nanoparticles and the microparticles into percolation paths between the front face of the pillar and the pad; and
sintering the arranged nanoparticles for forming metallic bonds at least between one of the nanoparticles or between the nanoparticles and the front face of the pillar or the pad.

2. The method of claim 1 , wherein no additional pressure over ambient pressure is applied between the front face of the pillar and the pad during evaporating the carrier fluid and sintering the arranged nanoparticles.

3. The method of claim 1 , wherein the pad comprises a pad material, the pillar comprises a pillar material, the microparticles comprise a microparticle material, and the nanoparticles comprise a nanoparticle material, wherein the pad material, the pillar material, the nanoparticle material and the microparticle material include Copper.

4. The method of claim 1 , wherein the pad, the pillar, the microparticles, and the nanoparticles include a same material.

5. The method of claim 1 , wherein applying the suspension comprises dipping the front face of the pillar into a reservoir providing the suspension.

6. The method of claim 1 , wherein the suspension is a bi-modal Copper ink.

7. The method of claim 1 , wherein the microparticles have a microparticle size and the nanoparticles have a nanoparticle size, and a ratio between the microparticle size and the nanoparticle size is chosen such that during evaporating of the carrier liquid, the nanoparticles can enter void regions between percolated microparticles.

8. The method of claim 7 , wherein the microparticle size is at least ten times larger than the nanoparticle size.

9. The method of claim 1 , wherein a volume ratio between the nanoparticles and the microparticles is between ten and one hundred in the suspension.

10. The method of claim 1 , wherein shaping the front face of the pillar comprises forming a dome-shaped front surface.

11. The method of claim 1 , wherein sintering is performed at a temperature lower than a melting temperature of the nanoparticles and the microparticles.

12. The method of claim 1 , wherein sintering the nanoparticles comprises providing formic acid.

13. The method of claim 1 , further comprising:
providing a plurality of pads arranged as an array; and
providing a plurality of pillars arranged as an array, each pillar having a front face;
wherein the steps of shaping, arranging, applying, evaporating and sintering are contemporaneously performed for a plurality of pad-pillar pairs.

Assignees

• IBM
• Intrinsiq Mat Ltd
• Univ Chemnitz Tech
• Sintef

Inventors

• Brunschwiler Thomas J
• Dixon Richard
• Visser Taklo Maaike M
• Wunderle Bernhard
• Yu Kerry
• Zuercher Jonas

Classifications

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07253

  changes in shapes · CPC title

• H10W72/253

  not comprising solid metals or solid metalloids, e.g. polymers or ceramics · CPC title

• H10W72/225

  Bumps having a filler embedded in a matrix · CPC title