Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
not comprising solid metals or solid metalloids, e.g. polymers or ceramics
not comprising solid metals or solid metalloids, e.g. polymers or ceramics · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/253 |
| Official title | {not comprising solid metals or solid metalloids, e.g. polymers or ceramics} |
| Display label | not comprising solid metals or solid metalloids, e.g. polymers or ceramics |
| Total patents | 1,453 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 96 |
| 2016 | 114 |
| 2017 | 137 |
| 2018 | 155 |
| 2019 | 148 |
| 2020 | 188 |
| 2021 | 156 |
| 2022 | 158 |
| 2023 | 111 |
| 2024 | 98 |
| 2025 | 81 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flux, substrate and manufacturing method, and device
US-2024282737-A1 · Aug 22, 2024 · US
Flip-chip assembly process comprising pre-coating interconnect elements
US-2015380395-A1 · Dec 31, 2015 · US
Chip arrangement and a method for manufacturing a chip arrangement
US-9224695-B2 · Dec 29, 2015 · US
Method for manufacturing a conducting contact on a conducting element
US-9224708-B2 · Dec 29, 2015 · US
Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium
US-2015371930-A1 · Dec 24, 2015 · US
Indirect printing bumping method for solder ball deposition
US-9216469-B2 · Dec 22, 2015 · US
Semiconductor device and manufacturing method therefor
US-2015357299-A1 · Dec 10, 2015 · US
Package structure and method of manufacturing the same
US-2015359096-A1 · Dec 10, 2015 · US
Technique for controlling positions of stacked dies
US-9209165-B2 · Dec 8, 2015 · US
Structure and method for integrated circuits packaging with increased density
US-2015348940-A1 · Dec 3, 2015 · US
Methods for forming semiconductor device packages
US-9202714-B2 · Dec 1, 2015 · US
Mounting structure and mounting method
US-9204551-B2 · Dec 1, 2015 · US
Conductive connections, structures with such connections, and methods of manufacture
US-2015325543-A1 · Nov 12, 2015 · US
Microelectronic package with stacked microelectronic units and method for manufacture thereof
US-9165911-B2 · Oct 20, 2015 · US
Method for bonding bare chip dies
US-2015294951-A1 · Oct 15, 2015 · US
Solder bump for ball grid array
US-9159687-B2 · Oct 13, 2015 · US
Stacked semiconductor die assemblies with partitioned logic and associated systems and methods
US-2015279431-A1 · Oct 1, 2015 · US
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
US-2015279828-A1 · Oct 1, 2015 · US
Integrated circuit interconnect crack monitor circuit
US-2015276854-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/253?
- CPC H10W72/253 is the Cooperative Patent Classification code for “not comprising solid metals or solid metalloids, e.g. polymers or ceramics.”
- How many patents are filed under CPC H10W72/253 (not comprising solid metals or solid metalloids, e.g. polymers or ceramics)?
- Our database includes 1,453 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/253 growing?
- Publication counts under this code: 98 in 2024 vs 81 in 2025 (latest complete years).