Solder ball and electronic member
US-9320152-B2 · Apr 19, 2016 · US
Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer
US10170442B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10170442-B2 |
| Application number | US-201715797296-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 30, 2017 |
| Priority date | Dec 8, 2016 |
| Publication date | Jan 1, 2019 |
| Grant date | Jan 1, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.
First claim
Opening claim text (preview).
What is claimed is: 1. A mount structure comprising two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members, the bonding material layer containing a first intermetallic compound and a stress relaxation material, the first intermetallic compound having a spherical, a columnar, or an oval spherical shape, and same crystalline structure as the first interface layer and the second interface layer, and partly closing space between the first interface layer and the second interface layer, the stress relaxation material containing tin as a main component, and filling around the first intermetallic compound, wherein the first interface layer, the second interface layer, and the first intermetallic compound are (Cu,Ni) 6 Sn 5 . 2. The mount structure according to claim 1 , wherein the bonding material layer further comprises a second intermetallic compound having a different crystalline structure from the first interface layer and the second interface layer. 3. The mount structure according to claim 1 , wherein the stress relaxation material contains Sn, and In or Bi. 4. The mount structure accordingly to claim 1 , wherein the stress relaxation material contains Sn, and Co or Ge. 5. A mount structure comprising two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members, the bonding material layer containing a first intermetallic compound and a stress relaxation material, the first intermetallic compound having a spherical, a columnar, or an oval spherical shape, and same crystalline structure as the first interface layer and the second interface layer, and partly closing space between the first interface layer and the second interface layer, the stress relaxation material containing tin as a main component, and filling around the first intermetallic compound, wherein the stress relaxation material contains Sn, and Co or Ge. 6. A mount structure comprising two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members, the bonding material layer containing a first intermetallic compound and a stress relaxation material, the first intermetallic compound having a spherical, a columnar, or an oval spherical shape, and same crystalline structure as the first interface layer and the second interface layer, and partly closing space between the first interface layer and the second interface layer, the stress relaxation material containing tin as a main component, and filling around the first intermetallic compound, wherein the bonding material layer further comprises a second intermetallic compound having a different crystalline structure from the first interface layer and the second interface layer, and wherein the second intermetallic compound is Ag 3 Sn.
Assignees
Inventors
Classifications
Bond pads specially adapted therefor · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title
of die-attach connectors · CPC title
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Frequently asked questions
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- What does patent US10170442B2 cover?
- A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the…
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).