Multilayer wiring board
US-9370092-B2 · Jun 14, 2016 · US
Solder ball and electronic member
US9320152B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9320152-B2 |
| Application number | US-201414405691-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 12, 2014 |
| Priority date | May 29, 2013 |
| Publication date | Apr 19, 2016 |
| Grant date | Apr 19, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni) 6 Sn 5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder ball formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.3 to 3.0 mass % of Bi, wherein an intermetallic compound of (Cu, Ni) 6 Sn 5 is formed in the Sn—Bi type alloy. 2. The solder ball according to claim 1 , wherein the Sn—Bi type alloy contains Ag, and a content of the Ag is 1.0 mass % or less. 3. The solder ball according to claim 1…
Assignees
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Classifications
Electricity · mapped topic
- H05K3/3465Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9320152B2 cover?
- A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic …
- Who is the assignee on this patent?
- Nippon Steel & Sumikin Mat Co, Nippon Micrometal Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/3465. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).