Stress isolation platform for MEMS devices

Patent metadata

Field	Value
Publication number	US-10167189-B2
Application number	US-201414502475-A
Country	US
Kind code	B2
Filing date	Sep 30, 2014
Priority date	Sep 30, 2014
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

First claim

What is claimed is:

1. An apparatus comprising:
a MEMS structure on a substrate, the substrate including at least one trench passing through the substrate to relieve stress on the MEMS structure and defining a MEMS platform and a peripheral region, wherein the MEMS structure is disposed on the MEMS platform; and
at least one flexible electrical conductor electrically coupled to the MEMS structure, spanning the at least one trench in the substrate, and physically contacting the peripheral region of the substrate and the MEMS platform, wherein the at least one flexible electrical conductor is configured to carry an electrical signal across the at least one trench and configured to flex in response to movement on either side of the at least one trench.

2. The apparatus of claim 1 , further comprising a top cap coupled to the substrate creating a seal and enclosing the MEMS structure.

3. The apparatus of claim 1 , wherein the apparatus further comprises at least one bridge physically coupling the peripheral region of the substrate and the MEMS platform.

4. The apparatus of claim 3 , wherein the at least one bridge comprises a plurality of bridges disposed between the peripheral region of the substrate and the MEMS platform.

5. The apparatus of claim 3 , wherein at least one bridge is a Z-shaped bridge, an L-shaped bridge, or a U-shaped bridge.

6. The apparatus of claim 1 , wherein the at least one flexible electrical conductor comprises a jumper.

7. The apparatus of claim 1 , wherein the at least one flexible electrical conductor comprises an electrical conductor on at least one bridge, the electrical conductor electrically coupled to the MEMS structure.

8. The apparatus of claim 1 , further comprising at least one pillar spanning a stress-relief gap and configured to rigidly suspend the MEMS platform within the substrate.

9. The apparatus of claim 1 , further comprising:
a bottom cap coupled to the substrate; and
at least one pillar physically coupling the bottom cap to the MEMS platform.

10. The apparatus of claim 9 , further comprising:
a top cap coupled to the substrate such that the MEMS platform is disposed between the top cap and the bottom cap, and defining a top void between the top cap and the MEMS platform.

11. A MEMS device comprising:
a substrate having a stress-relief gap therein defining a MEMS platform and a peripheral region;
a MEMS structure on the MEMS platform;
suspension means for rigidly suspending the MEMS platform within the substrate; and
electrical conductor means spanning the stress-relief gap, physically contacting the peripheral region of the substrate and the MEMS platform, and configured to carry an electrical signal across the stress-relief gap.

12. The MEMS device of claim 11 , wherein
the peripheral region circumscribes the stress-relief gap, and the MEMS device further comprises:
a bottom cap coupled to the peripheral region and defining a bottom void between the bottom cap and the MEMS platform; and
a top cap, coupled to the substrate such that the MEMS platform is disposed between the top cap and the bottom cap, and defining a top void between the top cap and the MEMS platform.

13. The MEMS device of claim 12 , wherein the suspension means comprise at least one pedestal extending between the bottom cap and the MEMS platform.

14. The MEMS device of claim 11 , wherein the suspension means comprise a plurality of bridges, each of the plurality of bridges comprising:
a first segment extending from the substrate in the direction of the MEMS platform;
a second segment extending from, and disposed at an angle to, the first segment; and
a third segment extending from, and disposed at an angle to, the second segment, and coupled to the MEMS platform.

15. The MEMS device of claim 11 , wherein the suspension means comprise a plurality of bridges, and wherein at least one of the plurality of bridges is a Z-shaped bridge, an L-shaped bridge or a U-shaped bridge.

16. The MEMS device of claim 11 , wherein the electrical conductor means comprise at least one conductive jumper spanning the stress-relief gap, the at least one conductive jumper electrically coupled to the MEMS structure.

17. The MEMS device of claim 11 , wherein the suspension means and the electrical conductor means comprise an electrical conductor on at least one bridge, the electrical conductor electrically coupled to the MEMS structure.

18. A MEMS device comprising:
a substrate having a stress-relief gap therein defining a MEMS platform and a peripheral region;
a MEMS structure on the MEMS platform; and
at least one flexible electrical conductor electrically coupled to the MEMS structure on the MEMS platform, spanning the stress-relief gap, and physically contacting the peripheral region of the substrate and the MEMS platform, the at least one flexible electrical conductor configured to carry an electrical signal across the stress-relief gap.

19. The MEMS device of claim 18 , further comprising:
a bottom cap coupled to the substrate and defining a bottom void between the bottom cap and the MEMS platform; and
at least one pillar physically coupled to the bottom cap and the MEMS platform, and configured to support the MEMS platform without bridges spanning the stress-relief gap.

20. The MEMS device of claim 19 , further comprising:
a top cap coupled to the substrate such that the MEMS platform is disposed between the top cap and the bottom cap, and defining a top void between the top cap and the MEMS platform.

Assignees

• Analog Devices Inc

Inventors

• Zhang Xin
• Judy Michael W
• Molnar George M
• Needham Christopher
• Jia Kemiao

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• B81B7/0048 Primary

  between the MEMS die and the substrate · CPC title