Vibration isolation interposer die

Patent metadata

Field	Value
Publication number	US-9227835-B2
Application number	US-201113299485-A
Country	US
Kind code	B2
Filing date	Nov 18, 2011
Priority date	Nov 23, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

First claim

What is claimed is:

1. An interposer chip comprising:
a die including:
a base portion;
a chip mounting portion;
one or more flexures connecting the base portion to the chip mounting portion;
a first plurality of projections extending from the base portion towards the chip mounting portion; and
a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

2. The interposer chip of claim 1 , wherein the first and second plurality of projections are configured to squeeze film dampen movement of the chip mounting portion with respect to the base portion.

3. The interposer chip of claim 1 , wherein the first plurality of projections include a first subset and a second subset of projections, the first subset extending in a first direction and the second subset extending in a second direction orthogonal to the first direction; and
wherein the second plurality of projections include a third subset and a fourth subset of projections, the third subset extending into interstices formed by the first subset and the fourth subset extending into interstices formed by the second subset.

4. The interposer chip of claim 3 , wherein the first plurality of projections include a fifth subset and a sixth subset of projections, the fifth subset extending in a direction opposite the first direction and the sixth subset extending in a direction opposite the second direction; and
wherein the second plurality of projections include a seventh subset and an eighth subset of projections, the seventh subset extending into interstices formed by the fifth subset and the eighth subset extending into interstices formed by the sixth subset.

5. The interposer chip of claim 1 , wherein the first and second plurality of projections extend in a circular pattern around the die between the base portion and the chip mounting portion.

6. The interposer chip of claim 1 , wherein the first and second plurality of projections include generally planar structures disposed such that faces of the first plurality of projections oppose faces of the second plurality of projections.

7. The interposer chip of claim 6 , wherein opposing faces are 10 microns or less apart from each other.

8. The interposer chip of claim 6 , wherein the generally planar structures of the first and second plurality of projections are orthogonal to a plane formed by the die.

9. The interposer chip of claim 8 , wherein a first subset of the generally planar structures of the first and second plurality of projections are oriented orthogonal to a first axis in the plane formed by the die and a second subset of the generally planar structures of the first and second plurality of projections are oriented orthogonal to a second axis in the plane formed by the die, the second axis orthogonal to the first axis.

10. The interposer chip of claim 1 , wherein the one or more flexures include a polymer material to dampen resonance of the one or more flexures.

11. The interposer chip of claim 1 , wherein the base portion comprises a perimeter of the die and the chip mounting portion comprises an interior area of the die.

12. The interposer chip of claim 1 , wherein gaps formed between the first and second plurality of projections are exposed to an environment surrounding the die.

13. The interpose chip of claim 1 , wherein the die is composed of silicon.

14. An inertial measurement unit (IMU) comprising:
an interposer die including:
a base portion configured to mount to a circuit board;
a chip mounting portion configured to have a chip mounted thereon;
one or more spring members connecting the base portion to the chip mounting portion;
wherein the base portion includes a first plurality of generally planar projections extending towards the chip mounting portion; and
wherein the chip mounting portion includes a second plurality of generally planar projections extending towards the base portion and into interstices formed by the first plurality of generally planar projections such that one or more apertures are defined that weave around the first and second plurality of generally planar projections; and

a sensor chip mounted to the chip mounting portion of the interposer die, the sensor chip including:
at least three micro-electro-mechanical system (MEMS) gyroscopes; and
at least three MEMS accelerometers.

15. The IMU of claim 14 , wherein the first and second plurality of generally planar projections are disposed such that faces of the first plurality of generally planar projections oppose faces of the second plurality of generally planar projections.

16. The IMU of claim 15 , wherein opposing faces are 10 microns or less apart from each other, and wherein the base portion of the interposer die and the sensor chip are 10 microns or less apart from each other.

17. The IMU of claim 15 , wherein the first and second plurality of generally planar projections are configured to squeeze film dampen movement of the chip mounting portion with respect to the base portion in directions parallel to a plane of the interposer die; and wherein a gap formed between the interposer die and the sensor chip is configured to squeeze film dampen movement of the base portion with respect the sensor chip in a direction orthogonal to the plane of the interposer die.

18. The IMU of claim 14 , wherein the first and second plurality of generally planar projections are orthogonal to a plane formed by the interposer die; and
wherein a first subset of the first and second plurality of generally planar projections are oriented orthogonal to a first axis in the plane formed by the interposer die and a second subset of the first and second plurality of generally planar projections are oriented orthogonal to a second axis in the plane formed by the interposer die, the second axis orthogonal to the first axis.

19. The IMU of claim 14 , wherein the interposer die is mounted to the sensor chip such that a gap is defined between the base portion of the interposer die and the sensor chip, wherein the gap is configured to provide squeeze film damping in a direction perpendicular to a plane of the interposer die.

20. A system comprising:
one or more processing devices;
one or more memory devices coupled to the one or more processing devices, the one or more memory devices including instructions which, when executed by the one or more processing devices, cause the one or more processing devices to perform navigation procedures;
an inertial measurement unit (IMU) mounted to a circuit board and coupled to the one or more processing devices, the IMU including:
an interposer die including:
a base portion mounted to the circuit board;
a chip mounting portion configured to have a chip mounted thereon;
one or more flexures connecting the base portion to the chip mounting portion;
a first plurality of projections extending from the base portion towards the chip mounting portion; and
a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections; and

a sensor chip mounted to the chip mounting portion of the interposer die, the sensor chip including:
at least three micro-electro-mechanical system (MEMS) gyroscopes; and
at least three MEMS accelerometers.

Assignees

• Horning Robert D
• Supino Ryan
• Honeywell Int Inc

Inventors

• Horning Robert D
• Supino Ryan

Classifications

• B81B7/0016 Primary

  Protection against shocks or vibrations, e.g. vibration damping · CPC title

• B81B2207/07

  Interconnects · CPC title

• B81B2201/025

  Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 · CPC title