Lid design for heat dissipation enhancement of die package

Patent metadata

Field	Value
Publication number	US-10163754-B2
Application number	US-201314140692-A
Country	US
Kind code	B2
Filing date	Dec 26, 2013
Priority date	Dec 26, 2013
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened.

First claim

What is claimed is:

1. A package structure, comprising:
a device die bonded to a package substrate;
a lid comprising a first portion, a second portion, and a third portion, the first portion being disposed over the device die, wherein trenches are formed on a surface of the first portion of the lid facing the device die, the trenches having a star shape in a cross-sectional view, the trenches having a parallel bar shape in a top-down view, the second portion and the third portion of the lid being on opposite ends of the first portion, a bottommost surface of the second portion and a bottommost surface of the third portion being coplanar, the bottommost surfaces of the second portion and the third portion being lower than a bottommost surface of the first portion, an inner sidewall of the second portion and an inner sidewall of the third portion being perpendicular to the topmost major surface of the device die;
an adhesive material directly connecting the second portion and the third portion of the lid to a topmost surface of a stiffener ring, the stiffener ring surrounding the device die at edges of the package substrate, the topmost surface of the stiffener ring being coplanar with the topmost major surface of the device die, and sidewalls of the stiffener ring facing the device die being coterminous with the inner sidewall of the second portion and the inner sidewall of the third portion, respectively, wherein sidewalls of the stiffener ring facing away from the device die are coterminous with edges of the package substrate, and wherein the stiffener ring comprises copper with a nickel coating;
a thermal interface material (TIM) filling a space between the device die and the lid, wherein the TIM fills the trenches formed on the surface of the first portion of the lid; and
a fan bonded to the lid.

2. The package structure of claim 1 , wherein at least one of the trenches has a depth being equal to or less than about half of a thickness of the lid.

3. The package structure of claim 1 , wherein the trenches of the lid have an irregular pattern that is designed to substantially match the heat dissipation pattern of the device die.

4. The package structure of claim 1 , wherein the package substrate has an interconnect structure connecting to a first plurality of bumps between the device die and a first surface of the package substrate and a second plurality of bumps on a second surface of the package substrate, wherein the second surface and the first surface are on opposite sides of the package substrate.

5. The package structure of claim 1 , wherein the trenches are formed in a region of the surface of the first portion of the lid directly over the device die.

6. The package structure of claim 1 , wherein a contact surface area between the TIM and the first portion of the lid is increased by the trenches in a range from about 2% to about 100% compared to a flat surface without the trenches.

7. The package structure of claim 1 , wherein at least one of the trenches has a width in a range from about 0.1 mm to about 40 mm and a depth in a range from about 0.05 mm to about 2.5 mm.

8. The package structure of claim 1 , wherein a thickness of the TIM between a bottom surface of the lid and a surface of the device die contacting the TIM is in a range from about 10 μm to about 300 μm.

9. The package structure of claim 1 , further comprising an open space along sidewalls of the device die, the open space being between the sidewalls of the device die and sidewalls of the stiffener ring, and the inner sidewalls of the second portion and the third portion of the lid being exposed to the open space.

10. The package structure of claim 1 , wherein the trenches extend diagonally in the top-down view with respect to side surfaces of the device die.

11. The package structure of claim 1 , wherein the trenches comprise a first plurality of trenches extending in a first direction in the top-down view and a second plurality of trenches extending in a second direction in the top-down view, the second direction being perpendicular with the first direction.

12. A package structure, comprising:
a device die bonded to a package substrate;
a lid disposed over the device die, the lid comprising a central region and a peripheral region, a bottommost surface of the peripheral region being substantially level, and the bottommost surface of the peripheral region being lower than a bottommost surface of the central region, wherein a vertical sidewall connects the bottommost surface of the central region and the bottommost surface of the peripheral region, the lid having trenches on the bottommost surface of the central region of the lid facing the device die and directly overlying the device die, the trenches having a star shape in a cross-sectional view, the trenches being shaped in long parallel bars in a top-down view;
a thermal interface material (TIM) filling a space between the device die and the lid, and filling the trenches on the bottommost surface of the central region of the lid;
a stiffener ring disposed over and adhered to edges of the package substrate, the stiffener ring comprising nickel-coated copper, wherein the bottommost surface of the peripheral region of the lid is adhered to the stiffener ring, wherein internal sidewalls of the stiffener ring are coterminous with the vertical sidewall connecting the bottommost surface of the central region and the bottommost surface of the peripheral region, and wherein external sidewalls of the stiffener ring and an outer sidewall of the peripheral region are coterminus with an outer edge of the package substrate; and
at least one open space below the lid and surrounding the device die, the at least one open space laterally separating the device die from the stiffener ring, and the at least one open space exposing the vertical sidewall of the lid and an edge of the device die.

13. The package structure of claim 12 , wherein the TIM comprises a polymer containing silicon, carbon, hydrogen, or oxygen.

14. The package structure of claim 12 , further comprising an underfill filling a space between the device die and the package substrate.

15. The package structure of claim 12 , wherein the bottommost surface of the peripheral region of the lid is higher than a topmost major surface of the device die.

16. The package structure of claim 12 , wherein the at least one open space exposes an outer portion of the bottommost surface of the central region of the lid.

17. A package structure, comprising:
a device die bonded to a package substrate;
a thermal interface material (TIM) disposed over a surface of the device die facing away from the package substrate;
a lid comprising a first portion having a first thickness, a second portion having a second thickness greater than the first thickness, and a third portion having the second thickness, the first portion being disposed over the TIM, the TIM filling trenches formed on a surface of the first portion of the lid facing the device die, wherein at least one of the trenches has a star shape in a cross-sectional view, wherein the at least one of the trenches has a parallel bar shape in a top-down view, and wherein the trenches are disposed only within all lateral extents of the device die;
a stiffener ring disposed over the package substrate, the stiffener ring comprising copper having a nickel coating, the stiffener ring having a total width measured between an outer edge and an inner edge of the stiffener ring in a cross-sectional view, wherein a bottommost surface of the stiffener ring is lower than a bottommost majo

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Ho Kuan-Lin
• Chiu Sheng-Hsiang
• Pan Hsin-Yu
• Liu Yu-Chih
• Chen Chin-Liang

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/26

  the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape · CPC title