Lid design for heat dissipation enhancement of die package
US-10163754-B2 · Dec 25, 2018 · US
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Patent family 53372136
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53372136 |
| Family type | — |
| Earliest priority | Dec 26, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10163754B2 — Lid design for heat dissipation enhancement of die package |
Representative publication
Best representative member for this family based on priority and filing country.
US10163754B2 — Lid design for heat dissipation enhancement of die package (published Dec 25, 2018)
Member publications
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Lid Design for Heat Dissipation Enhancement of Die Package
US-2015187679-A1 · Jul 2, 2015 · US