Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10161036-B2
Application number	US-201615220383-A
Country	US
Kind code	B2
Filing date	Jul 26, 2016
Priority date	Sep 11, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

The present invention may include: a tube providing an interior space in which substrates are processed; a substrate support portion stacking a plurality of substrates in the interior space of the tube in multi-level; a gas supply portion supplying a process gas to the plurality of substrates; an exhaust portion disposed to face the gas supply portion to absorb the process gas; and a flowage adjustment portion having spray openings formed along a circumference of the tube between the gas supply portion and the exhaust portion to spray an adjusting gas, and may be capable of controlling the amount of process gas supplied to an upper surface of the substrate by adjusting the flowage of process gas.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a tube providing an interior space in which substrates can be processed;
a substrate support portion for stacking a plurality of substrates in an interior space of the tube;
a gas supply portion for supplying a process gas to the plurality of substrates;
an exhaust portion disposed to face the gas supply portion to absorb the process gas; and
a flowage adjustment portion having spray openings formed along a circumference of the tube between the gas supply portion and the exhaust portion to spray an adjusting gas,
wherein the spray openings are formed on both sides of the tube, respectively, and are disposed to face each other in order to spray the adjusting gas in a direction crossing a direction in which the process gas is sprayed.

2. The substrate processing apparatus according to claim 1 , further comprising,
an exterior tube accommodating the tube therein,
wherein the flowage adjustment portion is disposed between the tube and the exterior tube.

3. The substrate processing apparatus according to claim 1 , wherein the substrate support portion further comprises:
a plurality of isolation plates each disposed between the substrates along a loaded direction of the substrates to divide the processing spaces for processing each of the plurality of substrates; and
a plurality of spray openings are formed on the tube at different heights corresponding to each of the processing spaces.

4. The substrate processing apparatus according to claim 1 , wherein the flowage adjustment portion further comprises:
a duct installed on an exterior surface of the tube to provide a flowage space for the adjusting gas to move to the spray openings; and
an adjusting gas supply line connected to the duct to supply the adjusting gas.

5. The substrate processing apparatus according to claim 4 , wherein the flowage adjustment portion further comprises a spray unit disposed inside of the duct to spray the adjusting gas inside of the duct corresponding to each of the processing spaces and connected to the adjusting gas supply line.

6. The substrate processing apparatus according to claim 1 , wherein the spray openings are formed in a shape of a slit or in a shape of a plurality of holes disposed in line.

7. The substrate processing apparatus according to claim 6 , wherein the spray openings are changed in width as going from the gas supply portion to the exhaust portion.

8. The substrate processing apparatus according to claim 3 , wherein the plurality of spray openings have a different area according to height.

9. The substrate processing apparatus according to claim 3 , wherein the plurality of spray openings are disposed at the same height as each of a plurality of spray nozzles spraying the process gas of the gas supply portion.

Assignees

• Eugene Technology Co Ltd

Inventors

• Hyon Jun Jin
• Je Sung Tae
• Song Byoung Gyu
• Kim Yong Ki
• Kim Kyoung Hun
• Kim Chang Dol
• Shin Yang Sik
• Kim Jae Woo

Classifications

• C23C16/45563

  Gas nozzles · CPC title

• C23C16/455

  characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• C23C16/4412 Primary

  Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps · CPC title

• H10P72/0448 Primary

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title