Cold Chain Packaging
US-2024300712-A1 · Sep 12, 2024 · US
Resin composition and flux
US10160827B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10160827-B2 |
| Application number | US-201515522883-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 14, 2015 |
| Priority date | Oct 31, 2014 |
| Publication date | Dec 25, 2018 |
| Grant date | Dec 25, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.
First claim
Opening claim text (preview).
The invention claimed is: 1. A resin composition, consisting of: a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule; and an epoxy resin in a mass ratio of 1:3 through 1:7, wherein the epoxy resin is contained in an amount of 75% by mass through 87.5% by mass based on the total mass of the resin composition. 2. A flux, consisting of: a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass through 16% by mass based on the total mass of the flux; an epoxy resin in an amount of 50% by mass through 60% by mass based on the total mass of the flux; a hardening accelerator; and a solvent, wherein a mass ratio between the hydroxyl carboxylic acid and the epoxy resin is 1:3.75 through 1:7. 3. The flux according to claim 2 , wherein the hydroxyl carboxylic acid is any of tartaric acid, malic acid, citric acid and hydroxymalonic acid. 4. The flux according to claim 3 , wherein the epoxy resin is tris-(2,3-epoxypropyl)-isocyanurate. 5. The flux according to claim 2 , wherein the epoxy resin is tris-(2,3-epoxypropyl)-isocyanurate.
Assignees
Inventors
Classifications
- C08K5/09Primary
Carboxylic acids; Metal salts thereof; Anhydrides thereof · CPC title
containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen · CPC title
derived from hydroxycarboxylic acids · CPC title
Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title
Compositions of unspecified macromolecular compounds · CPC title
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- What does patent US10160827B2 cover?
- A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, t…
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification C08K5/09. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).