Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof
US-12344758-B2 · Jul 1, 2025 · US
containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/423 |
| Official title | {containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen} |
| Display label | containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen |
| Total patents | 38 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2017 | 3 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 5 |
| 2021 | 1 |
| 2022 | 7 |
| 2023 | 5 |
| 2024 | 2 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Protective film forming composition
US-2025155813-A1 · May 15, 2025 · US
Room temperature ionic liquid curing agent
US-12247097-B2 · Mar 11, 2025 · US
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-12234318-B2 · Feb 25, 2025 · US
Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
US-12209160-B2 · Jan 28, 2025 · US
Two-component curable compositions
US-2024199792-A1 · Jun 20, 2024 · US
High refractive index materials
US-2024152047-A1 · May 9, 2024 · US
Euv resist underlayer film-forming composition
US-2023244148-A1 · Aug 3, 2023 · US
Ester compound and resin composition
US-2023242705-A1 · Aug 3, 2023 · US
Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound
US-11702578-B2 · Jul 18, 2023 · US
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-2023045615-A1 · Feb 9, 2023 · US
Composition for forming resist underlayer film
US-2023029997-A1 · Feb 2, 2023 · US
Room temperature ionic liquid curing agent
US-2022356298-A1 · Nov 10, 2022 · US
Phosphorated anhydride containing epoxy resin
US-11479638-B2 · Oct 25, 2022 · US
Compound, resin composition and polymerization product
US-2022185959-A1 · Jun 16, 2022 · US
Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
US-2022185945-A1 · Jun 16, 2022 · US
Method for producing polymer
US-2022153920-A1 · May 19, 2022 · US
Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof
US-2022145119-A1 · May 12, 2022 · US
Active ester compound
US-11299448-B2 · Apr 12, 2022 · US
Reversible self-repairing epoxy resin and preparation and recovery remoulding method therefor
US-11193000-B2 · Dec 7, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/423?
- CPC C08G59/423 is the Cooperative Patent Classification code for “containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen.”
- How many patents are filed under CPC C08G59/423 (containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen)?
- Our database includes 38 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/423 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).