Vapor deposition mask with metal plate

Patent metadata

Field	Value
Publication number	US-10160000-B2
Application number	US-201615214808-A
Country	US
Kind code	B2
Filing date	Jul 20, 2016
Priority date	Jan 12, 2012
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

First claim

The invention claimed is:

1. A vapor deposition mask, comprising:
a metal mask provided with a slit, and
a resin mask that is positioned on a front surface of the metal mask, and has openings corresponding to a pattern to be produced by vapor deposition, are stacked.

2. The vapor deposition mask according to claim 1 , wherein the metal mask is provided with a plurality of slits.

3. The vapor deposition mask according to claim 1 , wherein the slit is divided into a plurality of portions by a bridge.

4. The vapor deposition mask according to claim 1 , wherein the metal mask is made of a magnetic substance.

5. The vapor deposition mask according to claim 1 ,
wherein a cross-sectional shape of the opening broadens toward a vapor deposition source direction.

6. The vapor deposition mask according to claim 1 ,
wherein a cross-sectional shape of the slit broadens toward a vapor deposition source direction.

7. The vapor deposition mask according to claim 1 ,
wherein a cross-sectional shape of an entire opening formed by the slit of the metal mask and the opening of the resin mask presents a step shape.

8. The vapor deposition mask according to claim 1 ,
further comprising a barrier layer on end surfaces forming the opening of the resin mask.

9. The vapor deposition mask according to claim 1 , wherein a thickness of the metal mask is 5 μm to 100 μm inclusive.

10. The vapor deposition mask according to claim 1 , wherein a thickness of the resin mask is 3 μm to 25 μm inclusive.

11. The vapor deposition mask according to claim 1 , wherein the resin mask is made of a resin material having a thermal expansion coefficient of 16 ppm/° C. or less.

12. The vapor deposition mask according to claim 1 , wherein the resin mask is made of a resin material having a rate of humidity absorption of 1.0% or less.

13. The vapor deposition mask according to claim 1 , wherein the resin mask is made of a resin material having a thermal expansion coefficient of 16 ppm/° C. or less and a rate of humidity absorption of 1.0% or less.

14. The vapor deposition mask according to claim 1 , wherein a thickness of the resin mask is 4 μm to 8 μm inclusive.

15. The vapor deposition mask according to claim 1 , wherein the pattern is a high-definition pattern exceeding 300 ppi.

16. The vapor deposition mask according to claim 1 , wherein a thickness of the resin mask is 4 μm to 8 μm inclusive, and the pattern is a high-definition pattern exceeding 300 ppi.

17. The vapor deposition mask according to claim 1 , wherein a cross-sectional shape of the opening of the resin mask broadens toward the metal mask side.

18. The vapor deposition mask according to claim 1 , wherein a width of the opening at an end encountered to the metal mask is larger than a width of the opening at another end distant from the metal mask.

19. The vapor deposition mask according to claim 1 , wherein an angle (θ) connecting a lower bottom distal end in the opening of the resin mask and an upper bottom distal end in the opening of the same resin mask is within a range from 25° to 65° inclusive.

20. The vapor deposition mask according to claim 1 , wherein an end surface that forms the opening is in a curved shape protruding outward.

21. The vapor deposition mask according to claim 1 , wherein the resin mask is provided with at least a groove extended in a crosswise direction among the openings.

22. The vapor deposition mask according to claim 1 , wherein the resin mask is provided with at least a groove extended in a crosswise direction at a position overlapping the openings.

23. The vapor deposition mask according to claim 3 , wherein each of the portions is overlaid on two or more of the openings.

24. The vapor deposition mask according to claim 3 , wherein each of the portions is overlaid on a single number of the opening.

25. The vapor deposition mask according to claim 1 , wherein an angle formed by a straight line connecting a lower bottom distal end in the slit of the metal mask and an upper bottom distal end in the slit of the same metal mask, and the bottom surface of the metal mask is within a range from 25° to 65° inclusive.

26. The vapor deposition mask according to claim 1 , wherein each of the slits is overlaid on two or more of the openings, and wherein a width of the slit at an end encountered to the resin mask is smaller than a width of the slit at another end distant from the resin mask.

27. The vapor deposition mask according to claim 3 , wherein each of the portions is overlaid on two or more of the openings, and wherein a width of the slit at an end encountered to the resin mask is smaller than a width of the slit at another end distant from the resin mask.

28. The vapor deposition mask according to claim 3 , wherein each of the portions is overlaid on single number of the opening, and wherein a width of the slit at an end encountered to the resin mask is smaller than a width of the slit at another end distant from the resin mask.

29. The vapor deposition mask according to claim 3 , wherein the openings that are adjacent with each other in the crosswise direction are arranged by being displaced from each other in the lengthwise direction.

30. The vapor deposition mask according to claim 1 , wherein cross-sectional shape of both the slit of the metal mask and the opening of the resin mask broadens toward a vapor deposition source direction.

31. The vapor deposition mask according to claim 1 , wherein an angle (θ) connecting a lower bottom distal end in the opening of the resin mask and an upper bottom distal end in the opening of the same resin mask is within a range from 25° to 65° inclusive; and, another angle formed by a straight line connecting a lower bottom distal end in the slit of the metal mask and an upper bottom distal end in the slit of the same metal mask, and the bottom surface of the metal mask is within a range from 25° to 65° inclusive.

32. The vapor deposition mask according to claim 1 , a width of a flat portion (X) in the cross-section that is a difference in the width direction between a lower bottom distal end in the slit and an upper bottom distal end in the opening that are encountered to and adjacent to each other is in the range of 1-10 μm.

33. A vapor deposition mask, comprising:
a metal mask provided with a through-hole, and
a resin mask that is positioned on a front of surface of the metal mask, and has openings corresponding to a pattern to be produced by vapor deposition, are stacked.

34. The vapor deposition mask according to claim 33 , wherein the metal mask is provided with a plurality of through-holes.

35. The vapor deposition mask according to claim 33 , wherein the through-hole is divided into a plurality of portions by a bridge.

36. The vapor deposition mask according to claim 33 , wherein the metal mask is made of a magnetic substance.

37. The vapor deposition mask according to claim 33 ,
wherein a cross-sectional shape of the opening broadens toward a vapor deposition source direction.

38. The vapor deposition mask according to claim 33 ,
wherein a cross-sectional shape of the through-hole broadens toward a vapor deposition source direction.

39.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Hirobe Yoshinori
• Matsumoto Yutaka
• Ushikusa Masato
• Takeda Toshihiko
• Nishimura Hiroyuki
• Obata Katsunari
• Takekoshi Takashi

Classifications

• C23F1/02

  Local etching · CPC title

• B05C21/005

  Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title

• H05B33/10

  Apparatus or processes specially adapted to the manufacture of electroluminescent light sources · CPC title

• B32B38/0008

  Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation (heat treatment B32B38/0036) · CPC title

• B32B37/182

  one or more of the layers being plastic · CPC title