Vapor deposition mask with metal plate

Patent metadata

Field	Value
Publication number	US-9527098-B2
Application number	US-201514719355-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Jan 12, 2012
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.

First claim

The invention claimed is:

1. A metal mask with a resin plate, comprising:
slits located in the metal mask, the slits having a length running in a lengthwise direction and a width running in a crosswise direction,
wherein the resin plate is bonded on one surface of the metal mask, and
openings within the resin plate that define a deposition pattern to be produced by vapor deposition,
a plurality of the openings overlapping each of the slits and being located in correspondence within each of the slits.

2. The metal mask with the resin plate according to claim 1 ,
wherein the metal mask comprises a magnetic substance.

3. The metal mask with the resin plate according to claim 1 ,
wherein a thickness of the resin plate is 3 μm to 25 μm, inclusive.

4. The metal mask with the resin plate according to claim 2 ,
wherein a thickness of the resin plate is 3 μm to 25 μm, inclusive.

5. A metal mask with a resin plate, comprising:
a plurality slits located in the metal mask and defining rows of slits,
each slit having i) a length running in a lengthwise direction and ii) a width running in a crosswise direction, and
openings located in the resin plate,
a plurality of the openings located at a position in correspondence within each slit of the metal mask to thereby define a deposition pattern,
each opening having a length running in the lengthwise direction and a width running in the crosswise direction,
a resin plate being bonded on one surface of the metal mask.

6. The metal mask with the resin plate according to claim 5 ,
wherein the metal mask comprises a magnetic substance.

7. The metal mask with the resin plate according to claim 5 ,
wherein a thickness of the resin plate is 3 μm to 25 μm, inclusive.

8. The metal mask with the resin plate according to claim 6 ,
wherein a thickness of the resin plate is 3 μm to 25 μM, inclusive.

9. The metal mask with the resin plate according to claim 5 ,
wherein a thickness of the resin plate is 3 μm to 20 μm, inclusive.

10. The metal mask with the resin plate according to claim 5 ,
wherein a thickness of the resin plate is 3 μm to 10 μm, inclusive.

11. The metal mask with the resin plate according to claim 5 ,
wherein at least four openings are located within each slit of the metal mask.

12. The metal mask with the resin plate according to claim 5 ,
wherein eight openings are located within each slit of the metal mask.

13. The metal mask with the resin plate according to claim 5 ,
wherein the openings located within each slit of the metal mask are arranged as sets of two adjacent openings.

14. The metal mask with the resin plate according to claim 1 , wherein,
the openings have a length running in the lengthwise direction and a width running in the crosswise direction,
each opening broadens, in the crosswise direction, towards the one surface of the metal mask, and
a maximum width of each opening is less than a minimum width of each slit.

15. The metal mask with the resin plate according to claim 5 , wherein,
each opening broadens, in the crosswise direction, towards the one surface of the metal mask, and
a maximum width of each opening is less than a minimum width of each slit.

16. The metal mask with the resin plate according to claim 1 , wherein,
each slot broadens, in the crosswise direction away from the one surface of the metal mask, and
each opening broadens, in the crosswise direction, towards the one surface of the metal mask, and
a maximum width of each opening is less than a minimum width of each slit.

17. The metal mask with the resin plate according to claim 5 , wherein,
each slot broadens, in the crosswise direction away from the one surface of the metal mask, and
each opening broadens, in the crosswise direction, towards the one surface of the metal mask, and
a maximum width of each opening is less than a minimum width of each slit.

18. A metal mask with a resin plate, comprising:
slits located in the metal mask, the slits having a length running in a lengthwise direction and a width running in a crosswise direction, and
openings located in the resin plate, a plurality of the openings being located in positions in vertical registration with and within each of the slits, each opening having a length and a width, the openings defining a vapor deposition pattern,
wherein the resin plate is bonded at one side of the metal mask.

19. The metal mask with the resin plate according to claim 18 , wherein the metal mask comprises a magnetic substance.

20. The metal mask with the resin plate according to claim 1 , wherein,
a thickness of the resin plate is 3 μm to 25 μm, inclusive,
each slot broadens, in the crosswise direction away from the one surface of the metal mask, and
each opening broadens, in the crosswise direction, towards the one surface of the metal mask, and
a maximum width of each opening is less than a minimum width of each slit.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Hirobe Yoshinori
• Matsumoto Yutaka
• Ushikusa Masato
• Takeda Toshihiko
• Nishimura Hiroyuki
• Obata Katsunari
• Takekoshi Takashi

Classifications

• C23F1/02

  Local etching · CPC title

• H05B33/10

  Apparatus or processes specially adapted to the manufacture of electroluminescent light sources · CPC title

• B32B2311/00

  Metals, their alloys or their compounds · CPC title

• B05C21/005

  Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title

• B32B2310/0843

  using laser · CPC title