Ic-package interconnect for millimeter wave systems
US-2016190673-A1 · Jun 30, 2016 · US
US9608334B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9608334-B2 |
| Application number | US-201414231549-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 31, 2014 |
| Priority date | Mar 31, 2014 |
| Publication date | Mar 28, 2017 |
| Grant date | Mar 28, 2017 |
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A device is described. The device includes a chip, a reflector, and an antenna. The reflector is disposed on a surface of the chip. The reflector is a metalized layer on the surface of the chip.
Opening claim text (preview).
What is claimed is: 1. A system comprising: a frontside redistribution layer; a backside redistribution layer; a mold disposed between the frontside redistribution layer and the backside redistribution layer; a chip having a frontside, a backside, and sidewalls, the frontside of the chip disposed on the frontside redistribution layer; a reflector, which is a metalized layer, on the backside of the chip, wherein the backside of the chip is opposite the frontside redistribution layer; wherein the mold encapsulates the backside of the chip and the reflector and the mold encapsulates the sidewalls of the chip; and an antenna disposed on the backside redistribution layer, wherein the antenna is electrically connected with the chip through the frontside redistribution layer, wherein the antenna is at least partially aligned with the reflector at a distance from the backside of the chip; wherein the chip and the reflector are oriented with respect to the antenna such that the antenna is disposed nearer to the backside of the chip than to the frontside of the chip; and wherein the reflector and the antenna are separated by a portion of the mold that is between the reflector and the backside redistribution layer, and wherein the distance between the antenna and the reflector is fixed by the portion of the mold. 2. The system of claim 1 , wherein the distance between the antenna and the reflector is approximately 200 μm. 3. The system of claim 1 , further comprising a single transceiver and a plurality of antennas. 4. The system of claim 3 , wherein the plurality of antennas is configured to operate at a plurality of ranges. 5. The system of claim 3 , wherein the plurality of antennas is configured to perform a plurality of detection types comprising at least two of a list of detection types, the list of detection types comprising range detection, velocity detection, and angular resolution. 6. The system of claim 1 , wherein the antenna is a dipole fed by a differential signal. 7. The system of claim 1 , wherein the system operates on a frequency band from 76 GHz to 81 GHz. 8. The system of claim 1 , wherein the system operates on a frequency above 120 GHz. 9. The system of claim 1 , further comprising a dielectric rod lens to increase gain of the antenna.
on encapsulations · CPC title
Dispositions, e.g. layouts · CPC title
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title
for antennas · CPC title
at high-frequency [HF] or radio frequency [RF] · CPC title
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