Method for producing resistor

Patent metadata

Field	Value
Publication number	US-10157700-B2
Application number	US-201515304989-A
Country	US
Kind code	B2
Filing date	Apr 9, 2015
Priority date	Apr 25, 2014
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.

First claim

What is claimed is:

1. A method for producing a resistor, comprising:
a step of forming a through-hole in a sheet-like conductive material;
a step of fitting a resistive element piece shaped in accordance with a shape of the through-hole into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed on an inside of the through-hole; and
a step of stamping a region from the conductive material including the joint portions, thereby forming a resistor including a resistive element formed from the resistive element piece joined to a pair of electrodes formed from the sheet-like conductive material.

2. The method for producing a resistor according to claim 1 , wherein the step of fitting the resistive element piece includes a step of welding two side surfaces of the resistive element piece to the respective side surfaces of the conductive material in the through-hole at the joint portions.

3. The method for producing a resistor according to claim 2 , wherein the step of fitting the resistive element piece includes a step of press-fitting the resistive element piece into the through-hole.

4. The method for producing a resistor according to claim 2 , wherein in the step of stamping the region including the joint portions, a width of the region to be stamped is set narrower than a width of each of the joint portions.

5. The method for producing a resistor according to claim 2 , wherein the step of forming the through-hole includes providing a protrusion at a bottom of the through-hole, the protrusion protruding from an inner surface of the sheet-like conductive material on the through-hole side toward the through-hole.

6. The method for producing a resistor according to claim 1 , wherein the step of fitting the resistive element piece includes a step of press-fitting the resistive element piece into the through-hole.

7. The method for producing a resistor according to claim 6 , wherein in the step of stamping the region including the joint portions, a width of the region to be stamped is set narrower than a width of each of the joint portions.

8. The method for producing a resistor according to claim 6 , wherein the step of forming the through-hole includes providing a protrusion at a bottom of the through-hole, the protrusion protruding from an inner surface of the sheet-like conductive material on the through-hole side toward the through-hole.

9. The method for producing a resistor according to claim 1 , wherein in the step of stamping the region including the joint portions, a width of the region to be stamped is set narrower than a width of each of the joint portions.

10. The method for producing a resistor according to claim 9 , wherein the step of forming the through-hole includes providing a protrusion at a bottom of the through-hole, the protrusion protruding from an inner surface of the sheet-like conductive material on the through-hole side toward the through-hole.

11. The method for producing a resistor according to claim 1 , wherein the step of forming the through-hole includes providing a protrusion at a bottom of the through-hole, the protrusion protruding from an inner surface of the sheet-like conductive material on the through-hole side toward the through-hole.

Assignees

• Koa Corp

Inventors

• Arai Kosuke
• Yoshioka Tadahiko

Classifications

• H01C1/01

  Mounting; Supporting · CPC title

• H01C1/16

  Resistor networks not otherwise provided for · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C17/28 Primary

  adapted for applying terminals · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title