Thermal interface material with ion scavenger

Patent metadata

Field	Value
Publication number	US-10155894-B2
Application number	US-201415322691-A
Country	US
Kind code	B2
Filing date	Jul 7, 2014
Priority date	Jul 7, 2014
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

First claim

The invention claimed is:

1. A thermal interface material having at least first and second sides in direct, heat transfer contact with respective metallic surfaces, the thermal interface material comprising:
a blended combination of:
at least one elastomer polymer present in an amount between 2 wt. % and 10 wt. % based on a total weight of the thermal interface material;
at least one thermally conductive metallic filler; and
at least one ion scavenger.

2. The thermal interface material of claim 1 , wherein the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents, and combinations of the foregoing.

3. The thermal interface material of claim 1 , wherein the ion scavenger is selected from the group consisting of: an acid amide compound, a triazole compound, a tetrazole compound, a triazene compound, an oxamide compounds, a malonamide compound, and combinations of the foregoing.

4. The thermal interface material of claim 1 , wherein the ion scavenger is an acid amide compound.

5. The thermal interface material of claim 1 , wherein the ion scavenger is a selected from the group consisting of hydrazide, dihydrazide and combinations of the foregoing.

6. The thermal interface material of claim 1 , wherein the ion scavenger is selected from the group consisting of: decamethylenedicarboxylic acid disalicyloylhydrazide; 3-(N-salicyloyl)amino-1,2,4-triazole; and 2′, 3-bis [[3-[3, 5-di-tert-butyl-4-hydroxyphenyl] propionic]]propionyl hydrazide.

7. The thermal interface material of claim 1 , wherein the ion scavenger is selected from a compound according to a formula selected from the group consisting of Formula I to Formula XI or combinations thereof:

8. The thermal interface material of claim 1 , wherein the thermal interface material comprises 0.1 wt. % to 5 wt. % of the ion scavenger, based on the total weight of the thermal interface material.

9. The thermal interface material of claim 1 , further comprising at least one phase change material.

10. The thermal interface material of claim 1 , further comprising at least one coupling agent, wherein the at least one coupling agent is selected from the group consisting of: a titanate coupling agent, a zirconate coupling agent, a silane coupling agent, and combinations of the foregoing.

11. The thermal interface material of claim 1 , further comprising at least one crosslinker.

12. The thermal interface material of claim 1 , wherein the thermal interface material comprises:
5 wt. % to 10 wt. % of the at least one polymer;
50 wt. % to 95 wt. % of the at least one thermally conductive metallic filler; and
0.1 wt. % to 5 wt. % of the ion scavenger, based on the total weight of the thermal interface material.

13. The thermal interface material of claim 12 , further comprising:
2 wt. % to 5 wt. % of at least one wax;
0.1 to 0.5 wt. % of at least one antioxidant;
1 wt. % to 2 wt. % of at least one coupling agent; and
0.5 wt. % to 0.6 wt. % of at least one crosslinker based on the total weight of the thermal interface material;
wherein the thermal interface material comprises 75 wt. % to 90 wt. % of the at least one thermally conductive metallic filler, based on the total weight of the thermal interface material.

14. The thermal interface material of claim 12 , further comprising:
1.5 wt. % to 2 wt. % of at least one wax;
0.1 to 1 wt. % of at least one antioxidant; and
0.5 wt. % to 1 wt. % of at least one coupling agent;
wherein the thermal interface material comprises 85 wt. % to 95 wt. % of the at least one thermally conductive metallic filler, based on the total weight of the thermal interface material.

15. The thermal interface material of claim 14 , further comprising 0.1 wt. % to 1 wt. % of at least one crosslinker.

16. An electronic component comprising:
a heat sink;
an electronic chip;
a thermal interface material having at least first and second sides in direct, heat transfer contact between the heat sink and the electronic chip, the thermal interface material including:
a blended combination of:
at least one elastomer polymer present in an amount between 2 wt. % and 10 wt. % based on a total weight of the thermal interface material;
at least one thermally conductive metallic filler; and
at least one ion scavenger.

17. The thermal interface material of claim 1 , wherein the thermally conductive metallic filler comprises a metal selected from aluminum, copper, silver, zinc, nickel, tin, indium, and lead.

18. The thermal interface material of claim 1 , wherein the thermally conductive metallic filler comprises a nonmetal, metal oxide, or ceramics selected from carbon, graphite, carbon nanotubes, carbon fibers, graphenes, silicon nitride, alumina, aluminum nitride, boron nitride, zinc oxide, and tin oxide.

19. The thermal interface material of claim 1 , wherein the thermally conductive metallic filler comprises a metal oxide selected from alumina, boron nitride, zinc oxide, and tin oxide.

20. The electronic component of claim 16 , wherein the electronic component is selected from a central processing unit, a video graphics array, a server, a game console, a smart phone, or an LED board.

21. The thermal interface material of claim 1 , wherein the at least one thermally conductive metallic filler is present in an amount between 50 wt. % and 95 wt. % based on the total weight of the thermal interface material.

22. The thermal interface material of claim 21 , wherein the at least one thermally conductive metallic filler is present in an amount between 75 wt. % and 95 wt. % based on the total weight of the thermal interface material.

Assignees

• Honeywell Int Inc
• Liu Ya Qun
• Zeng Liang
• Wang Hui
• Zhang Bright
• Huang Hong Min

Inventors

• Liu Ya Qun
• Zeng Liang
• Wang Hui
• Zhang Bright
• Huang Hong Min

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title