Packaging for ultraviolet optoelectronic device

Patent metadata

Field	Value
Publication number	US-10147854-B2
Application number	US-201615388468-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	May 10, 2014
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.

First claim

What is claimed is:

1. A method of packaging a set of optoelectronic devices mounted on a device package, the method comprising:
polishing a light emitting face of a substrate of each of the set of optoelectronic devices, wherein a polished light emitting face of a corresponding optoelectronic device in the set of optoelectronic devices has a characteristic roughness length scale that is smaller than an ultraviolet operating radiation wavelength for the corresponding optoelectronic device as measured within the substrate;
placing an ultraviolet transparent polymer material adjacent to the polished light emitting face of each optoelectronic device in the set of optoelectronic devices, wherein the ultraviolet transparent polymer comprises a fluoropolymer having a thickness between 100 microns and 3 millimeters;
processing the ultraviolet transparent polymer material to adhere to the polished light emitting face and seal each optoelectronic device in the set of optoelectronic devices from an ambient environment; and
attaching a wave guiding structure over the ultraviolet transparent polymer material, wherein the attaching of the wave guiding structure over the ultraviolet transparent polymer material comprises heating the ultraviolet transparent polymer material to become flowable, wherein the wave guiding structure partially submerges into the ultraviolet transparent polymer material, wherein the wave guiding structure is physically attached with the ultraviolet transparent polymer.

2. The method of claim 1 , wherein the attaching of the wave guiding structure over the ultraviolet transparent polymer material comprises forming a plurality of separate lenses, each of the separate lenses formed over one of the optoelectronic devices in the set of optoelectronic devices.

3. The method of claim 1 , wherein the attaching of the wave guiding structure over the ultraviolet transparent polymer material comprises forming a plurality of interconnected lenses over all of the optoelectronic devices in the set of optoelectronic devices, and wherein the plurality of interconnected lenses are formed from the ultraviolet transparent polymer material.

4. The method of claim 1 , wherein the attaching of the wave guiding structure over the ultraviolet transparent polymer material comprises forming a single lens that extends over each of the optoelectronic devices in the set of optoelectronic devices and the device package.

5. The method of claim 1 , wherein the wave guiding structure comprises an optical fiber that attaches to each of the optoelectronic devices through the ultraviolet transparent polymer material.

6. The method of claim 5 , wherein each of the optoelectronic devices is configured to emit ultraviolet radiation at a different peak wavelength, and wherein the ultraviolet radiation of different peak wavelengths is coupled to the optical fiber.

7. The method of claim 1 , wherein the attaching of the wave guiding structure over the ultraviolet transparent polymer material comprises applying an adhesive material to at least one of: the wave guiding structure or the ultraviolet transparent polymer material, wherein the wave guiding structure adheres to the ultraviolet transparent polymer material.

8. The method of claim 1 , wherein the ultraviolet transparent polymer material comprises a thickness that varies over each of the optoelectronic devices.

9. The method of claim 1 , wherein the wave guiding structure comprises an external structure coupled to the device package, wherein the external structure comprises one of: an enclosure or an ultraviolet transparent wave guiding structure.

10. The method of claim 1 , wherein the ultraviolet transparent polymer material comprises a plurality of discontinuous portions, wherein each discontinuous portion of the ultraviolet transparent polymer material attaches to a different region of the wave guiding structure.

11. The method of claim 10 , further comprising applying a binding media between at least two of the discontinuous portions of the ultraviolet transparent polymer material.

12. The method of claim 11 , wherein the binding media is selected from the group consisting of: a fusable metallic alloy, a surface activated bonding material, an atomic diffusion bonding material, a flowable oxide, a liquid deposited adhesive, and a curing adhesive.

13. The method of claim 1 , wherein the ultraviolet transparent polymer material extends continuously over a top surface of each optoelectronic device and wraps around to each side surface thereof to cover a portion of each side.

14. The method of claim 1 , wherein the wave guiding structure comprises a total internal reflection (TIR) lens positioned over each optoelectronic device in the set of optoelectronic devices and the device package.

15. An optoelectronic device, comprising:
a device package having a cavity formed therein;
an optoelectronic component mounted within the cavity of the device package, the optoelectronic component having a top surface with a characteristic roughness length scale that is smaller than an ultraviolet operating radiation wavelength for the corresponding optoelectronic device as measured within a material forming the top surface;
an ultraviolet transparent polymer material formed over the optoelectronic component and the device package, the ultraviolet transparent polymer material extending over the optoelectronic component and the device package, wherein the ultraviolet transparent polymer material contacts only the top surface of the optoelectronic component and only a top surface of the device package that surrounds the optoelectronic component, the ultraviolet transparent polymer material adhering to the top surface of the optoelectronic component and sealing the optoelectronic component and the cavity from an ambient environment; and
a wave guiding structure formed over the ultraviolet transparent polymer material and the device package, wherein the wave guiding structure includes an optical fiber extending along all of a top surface of the ultraviolet transparent polymer material.

16. The optoelectronic device of claim 15 , wherein the ultraviolet transparent polymer material is bonded to the top surface of the optoelectronic component and the top surface of the device package.

17. The optoelectronic device of claim 15 , wherein the ultraviolet transparent polymer material is physically attached to the top surface of the optoelectronic component and the top surface of the device package.

18. A method of packaging an optoelectronic device, the method comprising:
placing an ultraviolet transparent polymer film across a device package on which an optoelectronic device is mounted, wherein the ultraviolet transparent polymer film comprises a fluoropolymer;
encapsulating the optoelectronic device with the ultraviolet transparent polymer film, wherein the ultraviolet transparent polymer film substantially fills any voids present on an emitting surface of the optoelectronic device, wherein the emitting surface has a characteristic roughness length scale that is smaller than an ultraviolet operating radiation wavelength for the corresponding optoelectronic device as measured within a material forming the emitting surface, and wherein the ultraviolet transparent polymer film and the device package seal a portion of the optoelectronic device from an ambient environment; wherein the encapsulating includes:
heating the ultraviolet transparent polymer film to become flowable;
monitoring the ultraviolet transparent polymer film to determine when the ultraviolet trans

Assignees

• Sensor Electronic Tech Inc

Inventors

• Shatalov Maxim S
• Smetona Saulius
• Dobrinsky Alexander
• Shur Michael
• Gaevski Mikhail

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/227

  Multiple bumps having different sizes · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/0198

  batch processes · CPC title