Film thickness measuring device, polishing apparatus, film thickness measuring method and polishing method

Patent metadata

Field	Value
Publication number	US-10138548-B2
Application number	US-201715647684-A
Country	US
Kind code	B2
Filing date	Jul 12, 2017
Priority date	Jul 13, 2016
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

Eddy current formable in a polishing target is detected as an impedance by an eddy current sensor. A resistance component and a reactance component of the impedance are associated with respective axes of a coordinate system having orthogonal axes, respectively. An angle calculator calculates the tangent of an intersection angle between a first straight line connecting a first point corresponding to an impedance for a zero film thickness, and a second point corresponding to an impedance for a non-zero film thickness, and a diameter of a circle passing through the first point. A film thickness calculator determines the film thickness from the tangent.

First claim

What is claimed is:

1. A film thickness measuring device for measuring a film thickness of a polishing target wherein when eddy current formable in the polishing target is detected as an impedance by an eddy current sensor, the film thickness measuring device receives an input of the impedance and determines the film thickness from the input impedance,
wherein when respective axes of a coordinate system having two orthogonal coordinate axes are associated with a resistance component and a reactance component of the impedance respectively, a point on the coordinate system which corresponds to the impedance forms at least a part of a circle, and
wherein the film thickness measuring device comprises:
an angle calculator that calculates a tangent or angular degree of an intersection angle between a first straight line connecting a first point corresponding to the impedance for a film thickness of zero and a second point corresponding to the impedance for a non-zero film thickness and a diameter of the circle which passes through the first point; and
a film thickness calculator that determines the film thickness from the tangent or the angular degree.

2. The film thickness measuring device according to claim 1 , further comprising a first storage unit capable of storing a center position of the circle that can be calculated from a plurality of the second points located on the circle and obtained by the eddy current sensor, wherein the angle calculator calculates the tangent or the angular degree from the stored center position of the circle, the first point and the second points obtained by the eddy current sensor after the center position of the circle is calculated.

3. The film thickness measuring device according to claim 1 , wherein points on the coordinate system that correspond to impedances obtained for different distances between the polishing target and the eddy current sensor form different circles, center of each of the different circles being located on a second straight line, and wherein the film thickness measuring device further comprises a second storage unit capable of storing information on the second straight line, and the angle calculator determines that a point which is located on the stored second straight line and at which a distance from the first point and a distance from the second point are equal to each other is a center of the circle to which the second point belongs, and calculates the tangent or the angular degree from the position of the center of the circle, the first point and the second point.

4. The film thickness measuring device according to claim 1 , wherein points on the coordinate system that correspond to impedances obtained for different distances between the polishing target and the eddy current sensor form the different circles, center of each of the different circles being located on a second straight line and the first point being located on the second straight line, and wherein the film thickness measuring device has a second storage unit capable of storing information on the second straight line, and the angle calculator calculates the tangent or the angular degree while the angular degree of an intersection angle between the stored second straight line and the first straight line is set as the angular degree of the intersection angle between the first straight line and the diameter of the circle that passes through the first point.

5. The film thickness measuring device according to claim 3 , further comprising a straight line calculator that calculates information on the second straight line, wherein with respect to each of the at least two circles corresponding to different distances between the polishing target and the eddy current sensor, the straight line calculator calculates a center of each of the circles from at least three points on the circle, and outputs information on a straight line connecting the calculated centers of the at least two circles as information on the second straight line to the second storage unit, and the second storage unit stores the input information on the second straight line.

6. The film thickness measuring device according to claim 3 , wherein points on the coordinate system that correspond to impedances obtained for different distances between the polishing target and the eddy current sensor form the different circles, and the first point is a point common to the different circles, and wherein the film thickness measuring device has a straight line calculator that calculates information on the second straight line, with respect to one of the circles, the straight line calculator calculates a center of the circle from at least three points on the circle, and outputs information of a straight line connecting the calculated center of the circle and the first point as information on the second straight line to the second storage unit, and the second storage unit stores the input information on the second straight line.

7. A polishing apparatus for polishing a polishing target comprising:
a polishing unit that polishes the polishing target;
an eddy current sensor that forms eddy current in the polishing target and detect the formed eddy current to measure a film thickness of the polishing target;
a receiver for outputting the detected eddy current as an impedance; and
the film thickness measuring device according to claim 1 that receives an input of the impedance and determines the film thickness from the input impedance.

8. A film thickness measuring method for measuring a film thickness of a polishing target by, when eddy current formable in the polishing target is detected as an impedance by an eddy current sensor, receiving an input of the impedance and determining the film thickness from the input impedance, wherein when respective axes of a coordinate system having two orthogonal coordinate axes are associated with a resistance component and a reactance component of the impedance respectively, a point on the coordinate system which corresponds to the impedance forms at least a part of a circle, and
wherein the film thickness measuring method comprises:
a step of calculating a tangent or angular degree of an intersection angle between a first straight line connecting a first point corresponding to the impedance for a film thickness of zero and a second point corresponding to the impedance for a non-zero film thickness and a diameter of the circle which passes through the first point; and
a step of determining the film thickness from the tangent or the angular degree.

9. A polishing method for polishing a polishing target comprising:
a polishing step of polishing the polishing target;
a step of forming eddy current in the polishing target and detecting the formed eddy current to measure a film thickness of the polishing target;
a step of outputting the detected eddy current as an impedance; and
a film thickness measuring step of receiving an input of the impedance and determining the film thickness from the input impedance,

wherein when respective axes of a coordinate system having two orthogonal coordinate axes are associated with a resistance component and a reactance component of the impedance respectively, a point on the coordinate system which corresponds to the impedance forms at least a part of a circle, and
wherein the film thickness measuring step comprises:
a step of calculating a tangent or angular degree of an intersection angle between a first straight line connecting a first point corresponding to the impedance for a film thickness of zero and a second point corresponding to the impedance for a non-zero film thickness and a diameter of the circle which passes through the first point; and
a step of determining the film thickness from the

Assignees

• Ebara Corp

Inventors

• Nakamura Akira

Classifications

• G01N27/025

  a current being generated within the material by induction · CPC title

• C23C14/542 Primary

  Controlling the film thickness or evaporation rate · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title

• B24B37/00

  Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title

• B24B49/105

  using eddy currents · CPC title