Low-stress floating-chip pressure sensors

Patent metadata

Field	Value
Publication number	US-10132705-B2
Application number	US-201615213971-A
Country	US
Kind code	B2
Filing date	Jul 19, 2016
Priority date	Jul 19, 2016
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.

First claim

What is claimed is:

1. A pressure sensor device comprising:
a header, the header defining:
an interior cavity comprising one or more tether connecting regions, wherein at least one of the one or more tether connecting regions is disposed on a header wall of the interior cavity;
an outer portion in communication with the interior cavity, the outer portion comprising a plurality of through bores; and
an exterior portion;

a pressure sensor chip disposed within the interior cavity of the header; and
one or more anchoring tethers attached to the corresponding one or more tether connecting regions;
wherein the pressure sensor chip is free to move within the interior cavity of the header, and wherein the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.

2. The pressure sensor device of claim 1 , further comprising a plurality of conductive header pins extending from the exterior portion of the header and through the corresponding plurality of through bores, and wherein the header pins are sealed to the header.

3. The pressure sensor device of claim 2 , wherein the pressure sensor chip comprises a plurality of bonding pads in electrical communication with one or more piezoresistors on the pressure sensor chip, and wherein the plurality of bonding pads are electrically connected to a corresponding plurality of the header pins by flexible wire.

4. The pressure sensor device of claim 1 , wherein the one or more anchoring tethers are attached to the pressure sensor chip at corresponding one or more connection regions on the pressure sensor chip.

5. The pressure sensor device of claim 1 , wherein the one or more anchoring tethers are non-conductive.

6. The pressure sensor device of claim 1 , further comprising a cover glass component in communication with the pressure sensor chip, the cover glass component comprising one or more of:
one or more grooves configured to interface with the one or more anchoring tethers;
a clearance recess configured to allow pressure media to freely interact with a pressure-sensitive portion of the pressure sensor chip while providing clearance around the pressure-sensitive portion of the pressure sensor chip; and
one or more cover glass through bores configured to allow pressure media to freely interact with a pressure-sensitive portion of the pressure sensor chip.

7. The pressure sensor device of claim 1 , further comprising a seal that encloses the pressure sensor chip and the interior cavity to form a sensor cavity, wherein the sensor cavity is configured for sealing after being filled with an oil, and wherein the oil is configured to transfer pressure from an outer portion of the sensor cavity to the pressure sensor chip.

8. The pressure sensor device of claim 7 , wherein the pressure sensor chip is configured to be surrounded by the oil and to freely move within the sensor cavity with movement of the pressure sensor chip limited by the one or more anchoring tethers.

9. The pressure sensor device of claim 1 , wherein a clearance is defined between the interior cavity and the pressure sensor chip to allow for at least three axes of translational movement of the pressure sensor chip relative to the interior cavity.

10. The pressure sensor device of claim 1 , further comprising a header insert attached to the header and configured to limit movement of the pressure sensor chip.

11. A method, comprising:
inserting a pressure sensor chip within a housing that includes a header, wherein the pressure sensor chip is free to move within an interior cavity of the header, and wherein the wherein the header comprises:
an interior cavity having one or more tether connecting regions, wherein at least one of the one or more tether connecting regions is disposed on a header wall of the interior cavity;
an outer portion in communication with the interior cavity, the outer portion comprising a plurality of through bores; and
an exterior portion; and

attaching one or more anchoring tethers to the corresponding one or more tether connecting regions of the header, and wherein the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.

12. The method of claim 11 , further comprising installing a plurality of conductive header pins in the corresponding plurality of through bores, the plurality of conductive header pins extending through the header, and wherein the header pins are sealed to the header.

13. The method of claim 12 , further comprising electrically connecting by flexible wire, the plurality of the header pins to a corresponding plurality of bonding pads on the pressure sensor chip, the plurality of bonding pads in electrical communication with one or more piezoresistors on the pressure sensor chip.

14. The method of claim 11 , further comprising attaching the one or more anchoring tethers to the pressure sensor chip at corresponding one or more connection regions on the pressure sensor chip.

15. The method of claim 11 , wherein the one or more anchoring tethers are non-conductive.

16. The method of claim 11 , further comprising installing a cover glass component in communication with the pressure sensor chip, the cover glass component comprising one or more of:
one or more grooves configured to interface with the one or more anchoring tethers;
a clearance recess configured to allow pressure media to freely interact with a pressure-sensitive portion of the pressure sensor chip while providing clearance around the pressure-sensitive portion of the pressure sensor chip; and
one or more cover glass through bores configured to allow pressure media to freely interact with a pressure-sensitive portion of the pressure sensor chip.

17. The method of claim 11 , further comprising:
installing a seal to enclose the pressure sensor chip and the interior cavity to form a sensor cavity;
filling the sensor cavity with an oil; and
sealing the sensor cavity;
wherein the oil is configured to transfer pressure from an outer portion of the sensor cavity to the pressure sensor chip.

18. The method of claim 17 , wherein the pressure sensor chip is configured to be surrounded by the oil and to freely move within the sensor cavity with movement of the pressure sensor chip limited by the one or more anchoring tethers.

19. The method of claim 11 , further comprising defining a clearance between the interior cavity and the pressure sensor chip to allow for at least three axes of translational movement of the pressure sensor chip relative to the interior cavity.

20. The method of claim 11 , further comprising attaching a header insert to the header to limit movement of the pressure sensor chip.

Assignees

• Kulite Semiconductor Products Inc

Inventors

• Stefanescu Sorin
• Ned Alexander A
• Vandeweert Joseph R
• Bemis Andrew

Classifications

• G01L9/0054 Primary

  integral with a semiconducting diaphragm · CPC title

• G01L19/145

  with stress relieving means · CPC title